IPC 4104:1999
$37.05
Specification for High Density Interconnect (HDI) and Microvia Materials
| Published By | Publication Date | Number of Pages |
| IPC | 1999-05-01 | 58 |
Covers the various conductive and dielectric materials that can be used for the fabrication of HDI and microvias.The 23 specification sheets included in IPC/JPCA-4104 specify the qualification and conformance requirements for such materials as photoimageable dielectric dry films and liquids, epoxy blends and coated foils. IPC/JPCA-4104 also includes six new test methods developed specifically for the testing of HDI and microvia materials.
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