31.080.99 - Other semiconductor devices
Showing 177–192 of 299 results
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BS EN 60747-16-5:2013+A1:2020
Semiconductor devices – Microwave integrated circuits. Oscillators Published By Publication Date Number of Pages BSI…
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BSI PD IEC TR 60747-5-12:2021
Semiconductor devices – Optoelectronic devices. Light emitting diodes. Test method of LED efficiencies Published By…
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BS IEC 62047-35:2019:2021 Edition
Semiconductor devices. Micro-electromechanical devices – Test method of electrical characteristics under bending deformation for flexible…
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BS IEC 62951-1:2017:2018 Edition
Semiconductor devices. Flexible and stretchable semiconductor devices – Bending test method for conductive thin films…
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BS EN 62047-13:2012
Semiconductor devices. Micro-electromechanical devices – Bend-and shear-type test methods of measuring adhesive strength for MEMS…
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BS EN 62047-10:2011
Semiconductor devices. Micro-electromechanical devices – Micro-pillar compression test for MEMS materials Published By Publication Date…
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BS EN 62047-6:2010
Semiconductor devices. Micro-electromechanical devices – Axial fatigue testing methods of thin film materials Published By…
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BS EN 60146-2:2000
Semiconductor convertors. General requirements and line commutated convertors – Self-commutated semiconductor converters including direct d.c.…
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BS EN 62047-16:2015
Semiconductor devices. Micro-electromechanical devices – Test methods for determining residual stresses of MEMS films. Wafer…
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BS EN 62047-21:2014
Semiconductor devices. Micro-electromechanical devices – Test method for Poisson’s ratio of thin film MEMS materials…
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BS EN 62047-12:2011
Semiconductor devices. Micro-electromechanical devices – Bending fatigue testing method of thin film materials using resonant…
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BS EN 62047-18:2013
Semiconductor devices. Micro-electromechanical devices – Bend testing methods of thin film materials Published By Publication…
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BS EN 62047-15:2015
Semiconductor devices. Micro-electromechanical devices – Test method of bonding strength between PDMS and glass Published…
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BS IEC 63068-4:2022
Semiconductor devices. Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices…
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BS IEC 62047-42:2022
Semiconductor devices. Micro-electromechanical devices – Measurement methods of electro-mechanical conversion characteristics of piezoelectric MEMS cantilever…
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BS EN IEC 63373:2022
Dynamic on-resistance test method guidelines for GaN HEMT based power conversion devices Published By Publication…