ASTM-B734 2008
$35.75
B734-97(2008) Standard Specification for Electrodeposited Copper for Engineering Uses
Published By | Publication Date | Number of Pages |
ASTM | 2008 | 4 |
1.1 This specification covers requirements for electrodeposited coatings of copper used for engineering purposes. Examples include surface hardening, heat treatment stop-off, as an underplate for other engineering coatings, for electromagnetic interferences (EMI) shielding in electronic circuitry, and in certain joining operations.
1.2 This specification is not intended for electrodeposited copper when used as a decorative finish, or as an undercoat for other decorative finishes.
1.3 This specification is not intended for electrodeposited copper when used for electroforming.
PDF Catalog
PDF Pages | PDF Title |
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1 | Scope Referenced Documents Terminology |
2 | Classification Ordering Information Coating Requirements |
3 | Sampling Test Methods |
4 | Rejection and Rehearing Certification X1.1 General X1.2 Materials X1.3 Procedure X1.4 Report |