{"id":439526,"date":"2024-10-20T08:09:35","date_gmt":"2024-10-20T08:09:35","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-16602-602023-tc\/"},"modified":"2024-10-26T15:16:57","modified_gmt":"2024-10-26T15:16:57","slug":"bs-en-16602-602023-tc","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-16602-602023-tc\/","title":{"rendered":"BS EN 16602-60:2023 – TC"},"content":{"rendered":"
PDF Pages<\/th>\n | PDF Title<\/th>\n<\/tr>\n | ||||||
---|---|---|---|---|---|---|---|
1<\/td>\n | 30477636 <\/td>\n<\/tr>\n | ||||||
95<\/td>\n | A-30441672 <\/td>\n<\/tr>\n | ||||||
96<\/td>\n | undefined <\/td>\n<\/tr>\n | ||||||
105<\/td>\n | 1 Scope <\/td>\n<\/tr>\n | ||||||
106<\/td>\n | 2 Normative references <\/td>\n<\/tr>\n | ||||||
108<\/td>\n | 3 Terms, definitions and abbreviated terms 3.1 Terms from other standards 3.2 Terms specific to the present standard <\/td>\n<\/tr>\n | ||||||
109<\/td>\n | 3.3 Abbreviated terms <\/td>\n<\/tr>\n | ||||||
111<\/td>\n | 3.4 Conventions <\/td>\n<\/tr>\n | ||||||
112<\/td>\n | 3.5 Nomenclature <\/td>\n<\/tr>\n | ||||||
113<\/td>\n | 4 Requirements for Class 1 components 4.1 Component programme management 4.1.1 General 4.1.2 Components control programme 4.1.2.1 Organization 4.1.2.2 Component control plan 4.1.3 Parts control board <\/td>\n<\/tr>\n | ||||||
114<\/td>\n | 4.1.4 Declared components list <\/td>\n<\/tr>\n | ||||||
115<\/td>\n | 4.1.5 Electrical and mechanical GSE 4.1.6 EQM components <\/td>\n<\/tr>\n | ||||||
116<\/td>\n | 4.2 Component selection, evaluation and approval 4.2.1 General 4.2.2 Manufacturer and component selection 4.2.2.1 General rules 4.2.2.2 Parts and material restriction <\/td>\n<\/tr>\n | ||||||
119<\/td>\n | 4.2.2.3 Preferred sources 4.2.2.4 Radiation hardness <\/td>\n<\/tr>\n | ||||||
120<\/td>\n | 4.2.2.5 Derating 4.2.3 Component evaluation 4.2.3.1 General <\/td>\n<\/tr>\n | ||||||
121<\/td>\n | 4.2.3.2 Component manufacturer assessment 4.2.3.3 Constructional analysis <\/td>\n<\/tr>\n | ||||||
122<\/td>\n | 4.2.3.4 Evaluation testing 4.2.4 Parts approval <\/td>\n<\/tr>\n | ||||||
123<\/td>\n | 4.3 Component procurement 4.3.1 General 4.3.2 Procurement specification <\/td>\n<\/tr>\n | ||||||
124<\/td>\n | 4.3.3 Screening requirements 4.3.4 Initial customer source inspection (precap) <\/td>\n<\/tr>\n | ||||||
125<\/td>\n | 4.3.5 Lot acceptance <\/td>\n<\/tr>\n | ||||||
126<\/td>\n | 4.3.6 Final customer source inspection (buy-off) 4.3.7 Incoming inspections <\/td>\n<\/tr>\n | ||||||
127<\/td>\n | 4.3.8 Radiation verification testing 4.3.9 Destructive physical analysis <\/td>\n<\/tr>\n | ||||||
128<\/td>\n | 4.3.10 Relifing 4.3.11 Manufacturer\u2019s data documentation deliveries <\/td>\n<\/tr>\n | ||||||
129<\/td>\n | 4.4 Handling and storage 4.5 Component quality assurance 4.5.1 General 4.5.2 Nonconformances or failures <\/td>\n<\/tr>\n | ||||||
130<\/td>\n | 4.5.3 Alerts 4.5.4 Traceability <\/td>\n<\/tr>\n | ||||||
131<\/td>\n | 4.5.5 Lot homogeneity for sampling test 4.6 Specific components 4.6.1 General 4.6.2 ASICs 4.6.3 Hybrids 4.6.4 One time programmable devices <\/td>\n<\/tr>\n | ||||||
132<\/td>\n | 4.6.5 Microwave monolithic integrated circuits 4.6.6 Connectors 4.7 Documentation <\/td>\n<\/tr>\n | ||||||
134<\/td>\n | 5 Requirements for Class 2 components 5.1 Component programme management 5.1.1 General 5.1.2 Components control programme 5.1.2.1 Organization 5.1.2.2 Component control plan 5.1.3 Parts Control Board <\/td>\n<\/tr>\n | ||||||
135<\/td>\n | 5.1.4 Declared Components List <\/td>\n<\/tr>\n | ||||||
136<\/td>\n | 5.1.5 Electrical and mechanical GSE 5.1.6 EQM components 5.2 Component selection, evaluation and approval 5.2.1 General <\/td>\n<\/tr>\n | ||||||
137<\/td>\n | 5.2.2 Manufacturer and component selection 5.2.2.1 General rules 5.2.2.2 Parts and material restriction <\/td>\n<\/tr>\n | ||||||
139<\/td>\n | 5.2.2.3 Radiation hardness <\/td>\n<\/tr>\n | ||||||
140<\/td>\n | 5.2.2.4 Derating 5.2.2.5 Preferred sources 5.2.3 Component evaluation 5.2.3.1 General <\/td>\n<\/tr>\n | ||||||
141<\/td>\n | 5.2.3.2 Component manufacturer assessment 5.2.3.3 Constructional analysis 5.2.3.4 Evaluation testing <\/td>\n<\/tr>\n | ||||||
142<\/td>\n | 5.2.4 Parts approval 5.3 Component procurement 5.3.1 General <\/td>\n<\/tr>\n | ||||||
143<\/td>\n | 5.3.2 Procurement specification 5.3.3 Screening requirements <\/td>\n<\/tr>\n | ||||||
144<\/td>\n | 5.3.4 Initial Customer Source Inspection (precap) 5.3.5 Lot acceptance <\/td>\n<\/tr>\n | ||||||
145<\/td>\n | 5.3.6 Final customer source inspection (buy-off) 5.3.7 Incoming inspections <\/td>\n<\/tr>\n | ||||||
146<\/td>\n | 5.3.8 Radiation verification testing 5.3.9 Destructive physical analysis <\/td>\n<\/tr>\n | ||||||
147<\/td>\n | 5.3.10 Relifing 5.3.11 Manufacturer\u2019s data documentation deliveries <\/td>\n<\/tr>\n | ||||||
148<\/td>\n | 5.4 Handling and storage 5.5 Component quality assurance 5.5.1 General 5.5.2 Nonconformances or failures <\/td>\n<\/tr>\n | ||||||
149<\/td>\n | 5.5.3 Alerts 5.5.4 Traceability 5.5.5 Lot homogeneity for sampling test 5.6 Specific components 5.6.1 General 5.6.2 ASICs <\/td>\n<\/tr>\n | ||||||
150<\/td>\n | 5.6.3 Hybrids 5.6.4 One time programmable devices <\/td>\n<\/tr>\n | ||||||
151<\/td>\n | 5.6.5 Microwave monolithic integrated circuits 5.6.6 Connectors 5.7 Documentation <\/td>\n<\/tr>\n | ||||||
153<\/td>\n | 6 Requirements for Class 3 components 6.1 Component programme management 6.1.1 General 6.1.2 Components control programme 6.1.2.1 Organization 6.1.2.2 Component control plan 6.1.3 Parts control board 6.1.4 Declared components list <\/td>\n<\/tr>\n | ||||||
154<\/td>\n | 6.1.5 Electrical and mechanical GSE 6.1.6 EQM components 6.2 Component selection, evaluation and approval 6.2.1 General <\/td>\n<\/tr>\n | ||||||
155<\/td>\n | 6.2.2 Manufacturer and component selection 6.2.2.1 General rules 6.2.2.2 Parts and material restriction <\/td>\n<\/tr>\n | ||||||
157<\/td>\n | 6.2.2.3 Preferred sources 6.2.2.4 Radiation hardness <\/td>\n<\/tr>\n | ||||||
158<\/td>\n | 6.2.2.5 Derating 6.2.3 Component evaluation 6.2.3.1 General <\/td>\n<\/tr>\n | ||||||
159<\/td>\n | 6.2.3.2 Component manufacturer assessment 6.2.3.3 Constructional analysis 6.2.3.4 Evaluation testing <\/td>\n<\/tr>\n | ||||||
160<\/td>\n | 6.2.4 Parts approval <\/td>\n<\/tr>\n | ||||||
161<\/td>\n | 6.3 Component procurement 6.3.1 General 6.3.2 Procurement specification 6.3.3 Screening requirements <\/td>\n<\/tr>\n | ||||||
162<\/td>\n | 6.3.4 Initial customer source inspection (precap) 6.3.5 Lot acceptance 6.3.6 Final customer source inspection (buy-off) <\/td>\n<\/tr>\n | ||||||
163<\/td>\n | 6.3.7 Incoming inspections 6.3.8 Radiation verification testing 6.3.9 Destructive physical analysis <\/td>\n<\/tr>\n | ||||||
164<\/td>\n | 6.3.10 Relifing <\/td>\n<\/tr>\n | ||||||
165<\/td>\n | 6.3.11 Manufacturer\u2019s data documentation deliveries 6.4 Handling and storage 6.5 Component quality assurance 6.5.1 General <\/td>\n<\/tr>\n | ||||||
166<\/td>\n | 6.5.2 Nonconformances or failures 6.5.3 Alerts 6.5.4 Traceability <\/td>\n<\/tr>\n | ||||||
167<\/td>\n | 6.5.5 Lot homogeneity for sampling test 6.6 Specific components 6.6.1 Overview 6.6.2 ASICs 6.6.3 Hybrids 6.6.4 One time programmable devices <\/td>\n<\/tr>\n | ||||||
168<\/td>\n | 6.6.5 Microwave monolithic integrated circuits 6.6.6 Connectors 6.7 Documentation <\/td>\n<\/tr>\n | ||||||
170<\/td>\n | 7 Quality levels <\/td>\n<\/tr>\n | ||||||
184<\/td>\n | 8 Evaluation and lot acceptance for retinned parts <\/td>\n<\/tr>\n | ||||||
185<\/td>\n | 9 Pure tin lead finish \u2013 risk analysis 9.1 Overview 9.2 Requirements <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":" Tracked Changes. Space product assurance. Electrical, electronic and electromechanical (EEE) components<\/b><\/p>\n |