{"id":273891,"date":"2024-10-19T18:24:23","date_gmt":"2024-10-19T18:24:23","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/astm-d5109-4\/"},"modified":"2024-10-25T14:46:16","modified_gmt":"2024-10-25T14:46:16","slug":"astm-d5109-4","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/astm\/astm-d5109-4\/","title":{"rendered":"ASTM-D5109"},"content":{"rendered":"<\/p>\n

1.1 These test methods cover the procedures for testing copper-clad laminates produced from fiber-reinforced, thermosetting polymeric materials intended for fabrication of printed wiring boards.<\/p>\n

This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements, see 7.2.1, 8.1, and 11.3.1.<\/p>\n

1.2 Metric units are the preferred units for these test methods. Inch-pound units, where shown, are presented for information only.<\/p>\n

1.3 The procedures appear in the following sections:<\/p>\n

PDF Catalog<\/h4>\n\n\n\n\n\n\n\n\n\n\n
PDF Pages<\/th>\nPDF Title<\/th>\n<\/tr>\n
1<\/td>\nScope
Referenced Documents
Terminology <\/td>\n<\/tr>\n
2<\/td>\nConditioning
Purity of Copper
Warp or Twist
Solvent Resistance
Solder Float Test <\/td>\n<\/tr>\n
3<\/td>\nPeel Strength Test
Peel Strength Test at Elevated Temperature
FIG. 1 <\/td>\n<\/tr>\n
4<\/td>\nVolume Resistivity and Surface Resistivity <\/td>\n<\/tr>\n
5<\/td>\nWater Absorption
Dielectric Breakdown Voltage Parallel to Laminations on Moisture-Conditioned Specimens
Permittivity and Dissipation Factor
TABLE 1 <\/td>\n<\/tr>\n
6<\/td>\nFlexural Strength (flatwise)
Flammability Rating
Oven Blister Test <\/td>\n<\/tr>\n
7<\/td>\nThickness Dimensions and Thickness Variation
Dimensional Instability <\/td>\n<\/tr>\n
8<\/td>\nKeywords
FIG. 2 <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

D5109-99(2004) Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
ASTM<\/b><\/a><\/td>\n2004<\/td>\n8<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":273899,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[1185,2637],"product_tag":[],"class_list":{"0":"post-273891","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-83-140-20","7":"product_cat-astm","9":"first","10":"instock","11":"sold-individually","12":"shipping-taxable","13":"purchasable","14":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/273891","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/273899"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=273891"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=273891"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=273891"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}