{"id":233218,"date":"2024-10-19T15:11:57","date_gmt":"2024-10-19T15:11:57","guid":{"rendered":"https:\/\/pdfstandards.shop\/product\/uncategorized\/bs-en-62258-22011\/"},"modified":"2024-10-25T09:40:42","modified_gmt":"2024-10-25T09:40:42","slug":"bs-en-62258-22011","status":"publish","type":"product","link":"https:\/\/pdfstandards.shop\/product\/publishers\/bsi\/bs-en-62258-22011\/","title":{"rendered":"BS EN 62258-2:2011"},"content":{"rendered":"

IEC 62258-2:2011 specifies the data formats that may be used for the exchange of data which is covered by other parts of the IEC 62258 series, as well as definitions of all parameters used according to the principles and methods of IEC 61360. It introduces a Device Data Exchange (DDX) format, with the prime goal of facilitating the transfer of adequate geometric data between die manufacturer and CAD\/CAE user and formal information models that allow data exchange in other formats such as STEP physical file format, in accordance with ISO 10303-21, and XML. The data format has been kept intentionally flexible to permit usage beyond this initial scope. It has been developed to facilitate the production, supply and use of semiconductor die products, including but not limited to wafers, singulated bare die, die and wafers with attached connection structures, minimally or partially encapsulated die and wafers. This standard reflects the DDX data format at version 1.3.0. With respect to the first edition, several parameters have been updated for this edition. This publication is to be read in conjunction with \/2.<\/p>\n

PDF Catalog<\/h4>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
PDF Pages<\/th>\nPDF Title<\/th>\n<\/tr>\n
7<\/td>\nEnglish
CONTENTS <\/td>\n<\/tr>\n
10<\/td>\nINTRODUCTION <\/td>\n<\/tr>\n
11<\/td>\n1 Scope and object
2 Normative references <\/td>\n<\/tr>\n
12<\/td>\n3 Terms and definitions
4 Requirements
5 Device Data eXchange format (DDX) file goals and usage
6 DDX file format and file format rules <\/td>\n<\/tr>\n
13<\/td>\n6.1 Data validity
6.2 Character set
6.3 SYNTAX RULES <\/td>\n<\/tr>\n
14<\/td>\n7 DDX file content
7.1 DDX file content rules <\/td>\n<\/tr>\n
16<\/td>\n7.2 DDX DEVICE block syntax <\/td>\n<\/tr>\n
17<\/td>\n7.3 DDX data syntax
8 Definitions of DEVICE block parameters <\/td>\n<\/tr>\n
18<\/td>\n8.1 BLOCK DATA <\/td>\n<\/tr>\n
19<\/td>\n8.2 DEVICE DATA <\/td>\n<\/tr>\n
22<\/td>\n8.3 GEOMETRIC DATA <\/td>\n<\/tr>\n
23<\/td>\nFigures
\n
Figure 1 \u2013 Relationship between geometric centre and geometric origin <\/td>\n<\/tr>\n
27<\/td>\n8.4 TERMINAL DATA <\/td>\n<\/tr>\n
28<\/td>\nTables
\n
Table 1 \u2013 Relationship between geometric centre and geometric origin
\n <\/td>\n<\/tr>\n
29<\/td>\nTable 2
\n Terminal shape co-ordinates <\/td>\n<\/tr>\n
31<\/td>\nTable 3 \u2013 Terminal IO types <\/td>\n<\/tr>\n
35<\/td>\n8.5 MATERIAL DATA <\/td>\n<\/tr>\n
36<\/td>\nTable 4 \u2013 Substrate Connection Parameters <\/td>\n<\/tr>\n
37<\/td>\n8.6 ELECTRICAL AND THERMAL RATING DATA <\/td>\n<\/tr>\n
38<\/td>\n8.7 SIMULATION DATA <\/td>\n<\/tr>\n
39<\/td>\n8.8 HANDLING, PACKING, STORAGE and ASSEMBLY DATA <\/td>\n<\/tr>\n
40<\/td>\n8.9 WAFER SPECIFIC DATA <\/td>\n<\/tr>\n
42<\/td>\n8.10 BUMP TERMINATION SPECIFIC DATA <\/td>\n<\/tr>\n
44<\/td>\n8.11 MINIMALLY PACKAGED DEVICE (MPD) SPECIFIC DATA <\/td>\n<\/tr>\n
45<\/td>\n8.12 QUALITY, RELIABILITY and TEST DATA <\/td>\n<\/tr>\n
46<\/td>\n8.13 OTHER DATA
8.14 CONTROL DATA <\/td>\n<\/tr>\n
50<\/td>\nAnnex A (informative)
\nAn example of a DDX DEVICE block <\/td>\n<\/tr>\n
52<\/td>\nAnnex B (informative)
\nGroups and Permutation <\/td>\n<\/tr>\n
55<\/td>\nAnnex C (informative)
\nA Typical CAD view from the DDX file block example given in Annex A
Figure C.1 \u2013 CAD representation of DDX example from Annex A <\/td>\n<\/tr>\n
56<\/td>\nAnnex D (informative)
\nProperties for Simulation <\/td>\n<\/tr>\n
58<\/td>\nAnnex E (informative)
\nTERMINAL and TERMINAL_TYPE graphical usage for CAD\/CAM systems <\/td>\n<\/tr>\n
59<\/td>\nFigure E.1 \u2013 Highlighting the MX and MY orientation properties <\/td>\n<\/tr>\n
60<\/td>\nFigure E.2 \u2013 Highlighting the angular rotational orientation properties <\/td>\n<\/tr>\n
61<\/td>\nAnnex F (informative)
\nCross-reference with IEC 61360-4
Table F.1 \u2013 Parameter List <\/td>\n<\/tr>\n
64<\/td>\nAnnex G (informative)
\nNotes on VERSION and NAME parameters <\/td>\n<\/tr>\n
65<\/td>\nAnnex H (informative)
\nNotes on WAFER parameters <\/td>\n<\/tr>\n
66<\/td>\nFigure H.1 \u2013 Illustrating the WAFER parameters <\/td>\n<\/tr>\n
67<\/td>\nAnnex I (informative)
\nAdditional notes <\/td>\n<\/tr>\n
68<\/td>\nAnnex J (informative)
\nDDX Version history
Table J.1 \u2013 Parameter Change History List <\/td>\n<\/tr>\n
71<\/td>\nAnnex K (informative)
\nParse Control <\/td>\n<\/tr>\n<\/table>\n","protected":false},"excerpt":{"rendered":"

Semiconductor die products – Exchange data formats<\/b><\/p>\n\n\n\n\n
Published By<\/td>\nPublication Date<\/td>\nNumber of Pages<\/td>\n<\/tr>\n
BSI<\/b><\/a><\/td>\n2011<\/td>\n74<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n","protected":false},"featured_media":233223,"template":"","meta":{"rank_math_lock_modified_date":false,"ep_exclude_from_search":false},"product_cat":[577,2641],"product_tag":[],"class_list":{"0":"post-233218","1":"product","2":"type-product","3":"status-publish","4":"has-post-thumbnail","6":"product_cat-31-080-99","7":"product_cat-bsi","9":"first","10":"instock","11":"sold-individually","12":"shipping-taxable","13":"purchasable","14":"product-type-simple"},"_links":{"self":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product\/233218","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media\/233223"}],"wp:attachment":[{"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/media?parent=233218"}],"wp:term":[{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_cat?post=233218"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/pdfstandards.shop\/wp-json\/wp\/v2\/product_tag?post=233218"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}