IPC TR-484:1986

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Results of IPC Copper Foil Ductility Round Robin Study

Published By	Publication Date	Number of Pages
IPC	1986-04-01	26

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Description

The Metallic foil Subcommittee of the Base Material Committee (formerly the Copper Foil Subcommittee of the Raw Materials Committee) decided in August 1982 to undertake a round robin test program on copper foil ductility. The objectives of this Round Robin Study were set by the Subcommittee to be:

the determination of typical ductility values for the various types and classes of copper foil from different foil manufacturers;
the establishment of minimum ductility requirements for the IPC-CF-150, Copper Foil for Printed Wiring Applications
the round robin testing of the fatigue ductility test method for metallic foils to
1. determine critical and sensitive test method steps, and
2. if necessary, generate the information to emphasize and elucidate any critical test method steps,
the establishment of the extent to which the relationship underlying the fatigue ductility test method can be utilized to predict the high-cycle fatigue behavior of metallic foils, and
the determination of the bending fatigue behavior of the copper foils

Additional information

Published Code	IPC
Published By	IPC International Inc, formerly Institute for Printed Circuits
Publication Date	1986-04-01
Pages Count	26
Language	English
File Size	1.6 MB

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IPC TR-484:1986

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