EIA/IS 46-1987

$20.15

Test Procedure for Resistance to Soldering (Vapor Phase Technique) for Surface Mount Devices

Published By	Publication Date	Number of Pages
ECIA	1987	5

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Description

There are two basic processes for soldering surface mount
connectors — vapor phase and infra-red. Both apply heat which the
total connector systems is exposed to with no insulating medium
(e.g. printed circuit boards) between the termination and connector
assembly. In addition to heat, the vapor phase system employs a
chemical medium (perfluoro-carbon) in a vapor form. Connector
materials are exposed to these mediums and thus must withstand both
heat and chemical vapors. There are three basic features which must
be evaluated prior to a material or connector configuration being
acceptable for surface mount process. These factors are:

A: Heat Impact

B: Dimensional Stability

C: Chemical Resistance

This procedure establishes a technique to evaluate plastic
materials used for connector housings which will be exposed to a
vapor phase reflow process.

Additional information