BS IEC 62951-3:2018
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Semiconductor devices. Flexible and stretchable semiconductor devices – Evaluation of thin film transistor characteristics on flexible substrates under bulging
| Published By | Publication Date | Number of Pages |
| BSI | 2018 | 26 |
IEC 62951-3:2018(E) specifies the method for evaluating thin film transistor characteristics on flexible substrates under bulging. The thin film transistor is fabricated on flexible substrates, including polyethylene terephthalate (PET), polyimide (PI), elastomer and others. The stress is applied by applying a uniformly-distributed pressure to the flexible substrate using the equipment.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 2 | undefined |
| 4 | CONTENTS |
| 5 | FOREWORD |
| 7 | INTRODUCTION |
| 8 | 1 Scope 2 Normative references 3 Terms and definitions 4 Test piece 4.1 General |
| 9 | 4.2 Size of a test piece 4.3 Measurement of dimensions 4.4 Storage prior to testing 5 Test apparatus and procedure 5.1 General 5.2 Test apparatus 5.2.1 General |
| 10 | 5.2.2 Apparatus |
| 11 | Figures Figure 1 – Pressure chamber open window shapes |
| 13 | Figure 2 – Typical example of bulging-type mechanical and electricalmeasurement test apparatus with heating system Figure 3 – Exemplary schematics of pressure chamber,pressure chamber open window |
| 14 | 5.3 Test procedure and analysis 5.3.1 Test procedure Figure 4 – Exemplary schematic of wire bonding |
| 16 | 5.3.2 Data analysis |
| 18 | Figure 5 – Exemplary DC characteristics for determining(a) μlin (b) μsat and (c) SS |
| 19 | 6 Test report Figure 6 – Representative bulge test data showingpressure-deflection relation for Ag-Pd/SiNx |
| 20 | Annex A (informative)Other types of electrical and mechanical test equipments A.1 Absorption type electrical and mechanical test equipment with heating system A.2 Bulging-type electrical and mechanical test equipment with halogen lamp heating system Figure A.1 – Exemplary schematic of absorption-type electrical andmechanical test equipment with heating system |
| 21 | Figure A.2 – Exemplary schematic of bulging-type electrical andmechanical test equipment with halogen lamp heating system |
| 22 | Annex B (informative)Failure pressure estimation Figure B.1 – Schematic for failure pressure estimation for 100 μm-thick polyimide assuming yield and tensile strength of 69 MPa and 231 MPa Table B.1 – Flexible substrate information (polyimide) |
| 23 | Table B.2 – Pressure calculation results |
| 24 | Bibliography |
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