ASTM-D5109:2004 Edition
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D5109-99(2004) Standard Test Methods for Copper-Clad Thermosetting Laminates for Printed Wiring Boards
| Published By | Publication Date | Number of Pages |
| ASTM | 2004 | 8 |
1.1 These test methods cover the procedures for testing copper-clad laminates produced from fiber-reinforced, thermosetting polymeric materials intended for fabrication of printed wiring boards.
This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use. For specific hazard statements, see 7.2.1, 8.1, and 11.3.1.
1.2 Metric units are the preferred units for these test methods. Inch-pound units, where shown, are presented for information only.
1.3 The procedures appear in the following sections:
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 1 | Scope Referenced Documents Terminology |
| 2 | Conditioning Purity of Copper Warp or Twist Solvent Resistance Solder Float Test |
| 3 | Peel Strength Test Peel Strength Test at Elevated Temperature FIG. 1 |
| 4 | Volume Resistivity and Surface Resistivity |
| 5 | Water Absorption Dielectric Breakdown Voltage Parallel to Laminations on Moisture-Conditioned Specimens Permittivity and Dissipation Factor TABLE 1 |
| 6 | Flexural Strength (flatwise) Flammability Rating Oven Blister Test |
| 7 | Thickness Dimensions and Thickness Variation Dimensional Instability |
| 8 | Keywords FIG. 2 |
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