31.080.99 - Other semiconductor devices
Showing 1–16 of 299 results
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JIS C 8155:2010
LED modules for general lighting service-Performance requirements Published By Publication Date Number of Pages JIS…
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JIS C 6790:2010
Load test of a bolt-clamped Langevin vibrator using wattmeter method Published By Publication Date Number…
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IEC TS 60747-19-2:2021
Semiconductor devices – Part 19-2: Smart sensors – Indication of specifications of sensors and power…
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IEC TR 62258-7:2007
Semiconductor die products – Part 7: XML schema for data exchange Published By Publication Date…
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IEC TR 62258-4:2012
Semiconductor die products – Part 4: Questionnaire for die users and suppliers Published By Publication…
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IEC TR 62258-3:2010
Produits à puces de semi-conducteurs – Partie 3 : bonnes pratiques recommandées pour la manipulation,…
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IEC TR 60747-5-12:2021
Semiconductor devices – Part 5-12: Optoelectronic devices – Light emitting diodes – Test method of…
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IEC PAS 60747-17:2011
Semiconductor devices – Discrete devices – Part 17: Magnetic and capacitive coupler for basic and…
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IEC 63244-1:2021
Semiconductor devices – Semiconductor devices for wireless power transfer and charging – Part 1: General…
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IEC 63229:2021
Semiconductor devices – Classification of defects in gallium nitride epitaxial film on silicon carbide substrate…
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IEC 63150-1:2019
Semiconductor devices – Measurement and evaluation methods of kinetic energy harvesting devices under practical vibration…
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IEC 63068-4:2022
Semiconductor devices – Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power…
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IEC 63068-3:2020
Semiconductor devices – Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power…
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IEC 63068-2:2019
Semiconductor devices – Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power…
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IEC 63068-1:2019
Semiconductor devices – Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power…
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IEC 62969-4:2018
Dispositifs à semiconducteurs – Interface à semiconducteurs pour les véhicules automobiles – Partie 4: Méthode…