IEEE 1780-2022
$47.13
IEEE Standard for Specifying Inertial Measurement Units (IMUs)
Published By | Publication Date | Number of Pages |
IEEE | 2022 |
New IEEE Standard – Active. Preparation of an inertial measurement unit (IMU) specification document is discussed in this standard. An outline is provided along with guidance for tailoring.
PDF Catalog
PDF Pages | PDF Title |
---|---|
1 | IEEE Std 1780-2022 Front cover |
2 | Title page |
4 | Important Notices and Disclaimers Concerning IEEE Standards Documents Notice and Disclaimer of Liability Concerning the Use of IEEE Standards Documents Translations |
5 | Official statements Comments on standards Laws and regulations Data privacy Copyrights |
6 | Photocopies Updating of IEEE Standards documents Errata Patents |
7 | IMPORTANT NOTICE |
8 | Participants |
9 | Introduction |
10 | Contents |
11 | 1. Overview 1.1 Scope 1.2 Purpose 1.3 Word usage |
12 | 2. Normative references 3. Specification overview 3.1 Specification scope 3.2 Item description 3.3 Definitions, acronyms, and abbreviations 3.3.1 Definitions |
13 | 3.4 Acronyms and abbreviations |
14 | 4. Applicable documents 4.1 Government 4.1.1 Specifications 4.1.2 Standards |
15 | 4.1.3 Drawings 4.1.4 Bulletins 4.2 Nongovernment 4.2.1 Specifications 4.2.2 Standards |
16 | 4.2.3 Drawings 4.2.4 Bulletins 5. Requirements 5.1 System interfaces 5.1.1 Electrical interface 5.1.1.1 External connector 5.1.1.1.1 Type and location 5.1.1.1.2 Pin assignments |
17 | 5.1.1.2 Input power forms 5.1.1.3 Discrete I/O |
18 | 5.1.1.4 Serial I/O 5.1.2 Data interface(s) 5.1.2.1 Message rate(s) |
19 | 5.1.2.2 Message format(s) 5.1.2.3 Message time of validity 5.1.2.4 Data latency 5.1.2.5 Message jitter |
20 | 5.1.3 Mechanical interface 5.1.3.1 Mounting dimensions 5.1.3.2 IMU reference axes 5.1.4 Thermal interface 5.2 Functional 5.2.1 System states and modes 5.2.2 External reset capability 5.2.3 Turn-on time |
21 | 5.2.4 Deactivation time 5.2.5 Time since turn-on 5.2.6 Fault history 5.2.7 Elapsed time indicator (ETI) 5.2.8 Number of turn-ons |
22 | 5.2.9 System resources 5.2.9.1 Throughput (processor) 5.2.9.2 System memory 5.2.10 System timing 5.2.10.1 Time of validity output signal 5.2.10.2 External synchronization 5.2.11 External reprogrammability 5.2.12 Configuration |
23 | 5.3 Performance 5.3.1 Translational data channels 5.3.1.1 Operating range 5.3.1.2 Response to out-of-range inputs |
24 | 5.3.1.3 Polarity 5.3.1.4 Scale factor error 5.3.1.4.1 Total scale factor error 5.3.1.4.2 Scale factor repeatability 5.3.1.4.3 Scale factor stability 5.3.1.4.4 Scale factor linearity error 5.3.1.4.5 Scale factor asymmetry 5.3.1.5 Bias 5.3.1.5.1 Total bias 5.3.1.5.2 Bias repeatability 5.3.1.5.3 Bias stability |
25 | 5.3.1.5.4 Bias instability 5.3.1.5.5 Bias vibration rectification error 5.3.1.6 Axis misalignment 5.3.1.7 Output noise 5.3.1.8 Quantization 5.3.1.9 Velocity random walk 5.3.1.10 Threshold 5.3.1.11 Dead band |
26 | 5.3.1.12 Size effect 5.3.1.13 Sculling 5.3.1.14 Frequency response 5.3.1.15 Filtering 5.3.2 Rotational data channels |
27 | 5.3.2.1 Operating range 5.3.2.2 Response to out-of-range inputs 5.3.2.3 Polarity 5.3.2.4 Scale factor error 5.3.2.4.1 Total scale factor error 5.3.2.4.2 Scale factor repeatability 5.3.2.4.3 Scale factor stability 5.3.2.4.4 Scale factor linearity error 5.3.2.4.5 Scale factor asymmetry 5.3.2.5 Bias 5.3.2.5.1 Total bias |
28 | 5.3.2.5.2 Bias repeatability 5.3.2.5.3 Bias stability 5.3.2.5.4 Bias instability 5.3.2.5.5 Bias g sensitivity 5.3.2.5.6 Bias vibration rectification error 5.3.2.6 Axis misalignment 5.3.2.7 Output noise 5.3.2.8 Quantization |
29 | 5.3.2.9 Angle random walk 5.3.2.10 Threshold 5.3.2.11 Dead band 5.3.2.12 Coning 5.3.2.13 Frequency response 5.3.2.14 Filtering 5.4 Physical characteristics 5.4.1 Weight |
30 | 5.4.2 Mounting hardware 5.4.3 Outline dimensions 5.4.4 External surfaces 5.4.5 Power 5.4.6 Emissions 5.4.6.1 Acoustic noise 5.4.6.2 Light 5.5 Environmental |
31 | 5.5.1 Nonoperating 5.5.1.1 Transportation and handling 5.5.1.2 Storage 5.5.1.3 Dormancy 5.5.2 Operating |
32 | 5.5.3 Environments 5.5.3.1 Acoustic noise 5.5.3.2 Altitude |
33 | 5.5.3.3 Atmosphere 5.5.3.3.1 Acidic atmosphere 5.5.3.3.2 Explosive atmosphere 5.5.3.4 Fluid susceptibility |
34 | 5.5.3.5 Fungus 5.5.3.6 Humidity |
35 | 5.5.3.7 Immersion 5.5.3.8 Magnetic fields 5.5.3.9 Motion 5.5.3.9.1 Angular motion 5.5.3.9.1.1 Acceleration 5.5.3.9.1.2 Rate 5.5.3.9.2 Linear motion 5.5.3.9.2.1 Acceleration |
36 | 5.5.3.9.2.2 Jerk 5.5.3.10 Nuclear, biological, and chemical (NBC) 5.5.3.11 Pressure 5.5.3.12 Radiation 5.5.3.12.1 Nuclear radiation |
37 | 5.5.3.12.2 Thermal radiation 5.5.3.12.2.1 Other thermal radiation 5.5.3.12.2.2 Solar radiation 5.5.3.13 Rain 5.5.3.13.1 Blowing rain 5.5.3.13.2 Dripping rain |
38 | 5.5.3.13.3 Icing/freezing rain 5.5.3.14 Rapid decompression 5.5.3.15 Rapid pressure change 5.5.3.16 Salt fog 5.5.3.17 Sand and dust |
39 | 5.5.3.18 Shock 5.5.3.18.1 Crash safety shock 5.5.3.18.2 Mechanical shock |
40 | 5.5.3.18.3 Thermal shock 5.5.3.19 Snow 5.5.3.19.1 Blowing snow 5.5.3.19.2 Falling snow 5.5.3.19.3 Snow load 5.5.3.20 Temperature 5.5.3.21 Vibration 5.5.3.21.1 Angular vibration |
41 | 5.5.3.21.2 Linear vibration 5.5.3.21.2.1 Random vibration 5.5.3.21.2.2 Sinusoidal dwell |
42 | 5.5.3.21.2.3 Sinusoidal sweep 5.5.3.22 Wash down 5.6 Electromagnetic environmental effects (E3) 5.6.1 Conducted emissions |
43 | 5.6.2 Conducted susceptibility 5.6.3 Radiated emissions 5.6.4 Radiated susceptibility 5.7 Life 5.7.1 Useful life |
44 | 5.7.2 Storage life 5.7.3 Operating life 5.8 Reliability and maintainability 5.8.1 Mean time between failure (MTBF) 5.8.2 Mean time to repair (MTTR) |
45 | 5.9 Testability 5.9.1 Built-in test (BIT) 5.9.1.1 Start-up BIT 5.9.1.2 Periodic BIT 5.9.1.3 Initiated BIT |
46 | 5.9.1.4 Failure detection rate 5.9.1.5 False alarm rate 5.9.2 Fault isolation 5.10 Safety |
47 | 5.11 Hardware design and construction 5.11.1 Corrosion 5.11.2 Dissimilar metals |
48 | 5.11.3 Hazardous materials 5.11.4 Soldering 5.11.5 Hardware design process 5.11.6 Parts selection 5.11.7 Workmanship 5.11.8 Identification and marking |
49 | 5.11.9 Interchangeability 5.11.10 External surfaces |
50 | 5.11.11 Isolation 5.11.12 Electrical bonding 5.12 Software design 5.13 Human factors |
51 | 6. Quality assurance 6.1 Verification methods 6.2 Qualification tests 6.2.1 Qualification test samples |
52 | 6.2.2 Qualification tests and sequence 6.3 Acceptance tests 6.3.1 Individual acceptance tests 6.3.1.1 Functional testing |
53 | 6.3.1.2 Environmental stress screening (ESS) 6.3.1.3 Rejection and retest 6.3.2 Lot acceptance tests 6.3.2.1 Sampling plan |
54 | 6.3.2.2 Acceptance/rejection criteria 6.3.2.3 Sample tests and sequence 6.3.2.4 Rejection and retest 6.3.2.5 Defects in items already accepted |
55 | 6.4 Reliability tests 6.4.1 Demonstration testing 6.4.2 Highly accelerated life testing (HALT) 6.5 Design verification test (DVT) 6.6 Software tests 6.7 Hardware logic tests 6.8 Latent defects 7. Preparation for delivery 7.1 Preservation, packaging, and packing |
56 | 7.2 Marking 8. Notes 8.1 Intended use 8.2 Ordering data 8.3 Compensation equations |
57 | 8.3.1 Translational data channels |
58 | 8.3.2 Rotational data channels |
59 | 8.4 Other |
60 | Annex A (informative) Bibliography |
61 | Back cover |