IEC 61190-1-2:2007
$43.55
Matériaux de fixation pour les assemblages électroniques – Partie 1-2: Exigences relatives aux pâtes à braser pour les interconnexions de haute qualité dans les assemblages de composants électroniques
| Published By | Publication Date | Number of Pages |
| IEC | 2007-04-26 | 42 |
| Published Code | IEC |
|---|---|
| Published By | International Electrotechnical Commission |
| Publication Date | 2007-04-26 |
| Pages Count | 42 |
| Language | France |
| Edition | 2.0 |
| File Size | 1.6 MB |
| ICS Codes | 31.190 - Electronic component assemblies |
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