BSI PD IEC/TS 62668-1:2016
$215.11
Process management for avionics. Counterfeit prevention – Avoiding the use of counterfeit, fraudulent and recycled electronic components
| Published By | Publication Date | Number of Pages |
| BSI | 2016 | 74 |
This part of IEC 62668 , which is a Technical Specification, defines requirements for avoiding the use of counterfeit, recycled and fraudulent components used in the aerospace, defence and high performance (ADHP) industries. It also defines requirements for ADHP industries to maintain their intellectual property (IP) for all of their products and services. The risks associated with purchasing components outside of franchised distributor networks are considered in IEC TS 62668‑2 . Although developed for the avionics industry, this specification may be applied by other high performance and high reliability industries at their discretion.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 4 | CONTENTS |
| 8 | FOREWORD |
| 10 | 1 Scope 2 Normative references 3 Terms, definitions and abbreviations 3.1 Terms and definitions |
| 14 | 3.2 Abbreviations |
| 16 | 4 Technical requirements 4.1 General |
| 17 | 4.2 Minimum avionics OEM requirements |
| 19 | Table 1 – Anti-counterfeit awareness training guidelines |
| 20 | 4.3 Intellectual property 4.3.1 General 4.3.2 Definition of intellectual property |
| 21 | 4.4 Counterfeit consideration 4.4.1 General 4.4.2 Legal definition of counterfeit 4.4.3 Fraudulent components |
| 22 | 4.4.4 How to establish traceability 4.4.5 Reasons for the loss of component traceability 4.5 Why is counterfeit a problem? 4.5.1 General Figure 1 – Suspect components perimeter |
| 23 | 4.5.2 General worldwide activities combating counterfeit issues |
| 24 | 4.5.4 Counterfeiting activities and avionics equipment |
| 26 | 4.5.5 Electronic components direct action groups |
| 27 | 4.6 Recycled components 4.6.1 General 4.6.2 Why does the avionics industry not use recycled components? 4.6.3 When do recycled components become suspect and potentially fraudulent? |
| 28 | 4.7 Original component manufacturer (OCM) anti-counterfeit guidelines 4.7.1 General 4.7.2 Chinese Reliable Electronic Component Supplier (RECS) audit scheme 4.7.3 Original component manufacturer (OCM) ISO 9001 and AS/EN/JISQ 9100 Third Party Certification 4.7.4 Original component manufacturer (OCM) trademarks 4.7.5 Original component manufacturer (OCM) IP control |
| 29 | 4.7.6 Original component manufacturer (OCM) physical part marking and packaging marking 4.7.7 The Semiconductor Industries Association Anti Counterfeit Task Force (ACTF) |
| 30 | 4.7.8 USA Trusted Foundry Program 4.7.9 USA Trusted IC Supplier Accreditation Program 4.7.10 Physical unclonable function (PUF) 4.7.11 Original component manufacturer (OCM) best practice 4.8 Distributor minimum accreditations |
| 31 | 4.9 Distributor AS/EN/JISQ 9120 Third Party Certification 4.10 Franchised distributor network 4.10.1 General |
| 32 | 4.10.2 SAE AS6496 4.10.3 Control stock through tracking schemes 4.10.4 Control scrap 4.10.5 RECS 4.11 Non-franchised distributor anti-counterfeit guidelines 4.11.1 General |
| 33 | 4.11.2 CCAP-101 certified program for independent distributor 4.11.3 SAE AS6081 4.11.4 OEM managed non-franchised distributors 4.11.5 Brokers 4.12 Avionics OEM anti-counterfeit guidelines when procuring components 4.12.1 General |
| 34 | 4.12.2 Buy from approved sources 4.12.3 Traceable components 4.12.4 Certificate of conformance and packing slip |
| 35 | 4.12.5 Plan and buy sufficient quantities 4.12.6 Use of non- franchised distributors |
| 36 | 4.12.7 Brokers 4.12.8 Contact the original manufacturer 4.12.9 Obsolete components and franchised aftermarket sources 4.12.10 IEC TS 62239-1 approved alternatives 4.12.11 Product redesign |
| 37 | 4.12.12 Non traceable components 4.12.13 OEM anti-counterfeit plans including SAE AS5553 and SAE AS6174 |
| 38 | Table 2 – IEC TS 62668-1 requirements waived if OEM has an approved SAE AS5553A plan |
| 39 | 4.13 OEM anti-counterfeit guidelines for their products 4.13.1 IP control 4.13.2 Tamper-proofing the OEM design |
| 40 | 4.13.3 Tamper-proof labels 4.13.4 Use of ASICS and FPGAs with IP protection features 4.13.5 Control the final OEM product marking |
| 41 | 4.13.6 Control OEM scrap 4.13.7 OEM trademarks and logos 4.13.8 Control delivery of OEM products and spares and their useful life 4.13.9 Repairs to OEM products |
| 42 | 4.14 Counterfeit, fraud and component recycling reporting 4.14.1 General 4.14.2 USA FAA suspected unapproved parts (SUP) program 4.14.3 EASA 4.14.4 UK counterfeit reporting 4.14.5 EU counterfeit reporting 4.14.6 UKEA anti-counterfeiting forum |
| 43 | Annex A (informative) Useful contacts A.1 World Intellectual Property Organization (WIPO) A.1.1 General A.1.2 What is WIPO? A.1.3 WIPO Intellectual Property Services |
| 45 | A.1.4 WIPO global network on Intellectual Property (IP) Academies A.2 Anti-Counterfeiting Trade Agreement (ACTA) A.2.1 ACTA |
| 46 | A.2.2 Global Anti-Counterfeiting Network (GACG) A.3 World Semiconductor Council (WSC) A.4 SEMI |
| 48 | A.5 Electronics Authorized Directory A.6 UK A.6.1 The UK intellectual property office A.6.2 Alliance for IP |
| 49 | A.6.3 UK Chartered Trading Standards Institute A.6.4 UK HM Revenue and Customs A.6.5 ESCO Anti-counterfeiting Forum (formerly UKEA Anti-Counterfeiting Forum) A.6.6 Electronic Component Supplier Network (ESCN) |
| 50 | A.6.7 UK Ministry of Defence A.7 Europe A.7.1 Europa Summaries of EU Legislation A.7.2 Europol, the European Law Enforcement Agency A.7.3 European Patent Office A.7.4 Europe at OHIM |
| 51 | A.7.5 European Aviation Safety Agency (EASA) A.7.6 IECQ audit schemes |
| 52 | A.7.7 BEAMA A.8 USA A.8.1 United States Patent and Trademark Office A.8.2 The International Trade Administration, US Department of Commerce |
| 53 | A.8.3 US Embassy in China information A.8.4 International Intellectual Property Alliance |
| 54 | A.8.5 The Federal Aviation Administration (FAA) A.8.6 Trusted Access Program Office (TAPO) |
| 55 | A.8.7 Defense Microelectronics Activity (DMEA) A.8.8 Independent Distributors of Electronics Association (IDEA) |
| 56 | A.8.9 ECIA formerly National Electronic Distributors Association (NEDA) |
| 57 | A.8.10 Components Technology Institute Inc. (CTI) A.8.11 Defense Logistics Agency (DLA) A.8.12 DFARS A.8.13 IAQG |
| 58 | A.9 China A.9.1 State Intellectual Property office of the P.R.C. A.9.2 Chinese Patent and Trademark Office A.9.3 China Electronics Associations: A.9.4 China Electronics Quality Management Association (CQAE) A.9.5 Chinalawinfo.Co Ltd., for Law info China A.10 Japan – Japanese Patent Office (JPO) A.11 Physical unclonable function |
| 59 | A.12 The Hardware Intrinsic Security (HIS) initiative |
| 60 | A.13 Examples of tamper-proof design companies A.14 Examples of FPGA die serialization A.15 Examples of NVRAM manufacturers A.16 SAE G-19 |
| 62 | A.17 iNEMI |
| 63 | A.18 OECD A.19 ICC A.20 Applied DNA Sciences |
| 64 | Annex B (informative) Examples of aftermarket sources B.1 Examples of franchised aftermarket sources B.2 Examples of sources of franchised die which can be packaged B.3 Examples of third party custom packaging houses which provide aftermarket solutions |
| 65 | B.4 Examples of emulated aftermarket providers |
| 66 | Annex C (informative) Typical example of a RECS certificate |
| 67 | Annex D (informative) Flowchart of IEC TS 62668-1 requirements |
| 69 | Bibliography |
