BSI PD IEC/TS 62239-2:2017
$198.66
Process management for avionics. Management plan – Preparation and maintenance of an electronic COTS assembly management plan
| Published By | Publication Date | Number of Pages |
| BSI | 2017 | 68 |
This part of IEC 62239, which is a technical specification, applies to the development of COTS assembly management plans (CAMPs) for the integration and management of electronic COTS assemblies (see 3.1.13 and 3.1.20) in electronic systems used in the ADHP markets where reliability is generally critical.
NOTE 1 Best practices for managing the electronic components within the electronic assemblies are described in IEC TS 62239-1 and SAE EIA-STD-4899 which describe the electronic component management program (ECMP). In cases where the electronic components can be identified and managed at the component level, ECMP can be considered as an option to manage the components.
NOTE 2 The distinction between an electronic component and an electronic assembly is provided by the definitions in Clause 3. This distinction between an electronic component and an electronic assembly is not always recognized by industry: for example, filters, contactors, power supply modules, relays, magnetic assemblies, etc., can be considered as either components or assemblies. In each application it is considered a best practice for the user of this document to clarify this distinction.
Depending on program or product line requirements and/or the technical characteristics of the electronic COTS assemblies and in agreement with the customer, the electronic COTS assembly management plans (CAMPs) could consider tailoring the requirements of this document. See Annex A.
Although developed for the avionics industry, this document can be applied by other high performance and high reliability industries at their discretion.
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 4 | CONTENTS |
| 6 | FOREWORD |
| 8 | INTRODUCTION |
| 9 | 1 Scope 2 Normative references 3 Terms, definitions and abbreviated terms |
| 10 | 3.1 Terms and definitions |
| 16 | 3.2 Abbreviated terms |
| 17 | 4 Technical requirements 4.1 General |
| 18 | 4.2 COTS assembly selection 4.2.1 General 4.2.2 Design assurance 4.3 COTS assembly application 4.3.1 General |
| 19 | 4.3.2 Functionality 4.3.3 COTS assembly compatibility 4.3.4 Assembly materials 4.3.5 Heat dissipation and cooling 4.3.6 Integrity analysis |
| 20 | 4.3.7 Reliability analysis |
| 21 | 4.3.8 Useful life 4.3.9 Storage life 4.3.10 Failure modes and effects analysis 4.3.11 Maintainability and testability |
| 22 | 4.3.12 Markings 4.3.13 Safety 4.3.14 Acceptance by the plan owner 4.4 Electronic COTS assembly manufacturer selection 4.4.1 General |
| 23 | Tables Table 1 – Electronic COTS assembly manufacturer selection recommendations |
| 24 | 4.4.2 Electronic COTS assembly manufacturer quality system 4.4.3 Franchised distributor quality system 4.4.4 Electronic COTS assembly derating and stress analysis 4.4.5 Electronic COTS assembly qualification/characterization |
| 25 | 4.4.6 Electronic components used in electronic COTS assembly: Selection/qualification and acceptance 4.4.7 Electronic COTS assembly manufacturing and handling 4.4.8 Electronic COTS assembly qualification approval 4.4.9 Electronic COTS assembly final acceptance 4.4.10 Configuration management and documentation |
| 26 | 4.4.11 Plan owner documentation |
| 27 | 4.4.12 Electronic COTS assembly manufacturer documentation 4.4.13 Life cycle management 4.4.14 COTS assembly availability risk management |
| 28 | 4.4.15 Equipment/system corrective action and product (electronic COTS assembly) change notices 4.4.16 Electronic COTS assembly substitution or alternative source 5 Plan administration 5.1 Plan content and organization |
| 29 | 5.2 Plan terms, definitions and abbreviated terms 5.3 Plan focal point 5.4 Plan references 5.5 Plan applicability 5.6 Plan implementation 5.7 Plan acceptance |
| 30 | Annex A (informative) Template for tailoring the requirements of IEC TS 62239-2 Table A.1 – Template for tailoring requirements of IEC TS 62239-2 |
| 31 | Annex B (informative)Cross-reference between IEC TS 62239-2 and SAE EIA-933B Table B.1 – Cross-reference between IEC TS 62239-2 and SAE EIA-933B requirements |
| 33 | Annex C (informative)Electronic COTS assembly design guidelines and COTS assembly manufacturer’s risk assessment C.1 COTS assembly design guidelines C.1 COTS assembly design guidelines C.1.1 Open system architecture C.1.2 Risk assessment and performance C.1.3 Assembly criticality C.2 COTS assembly manufacturer’s risk assessment |
| 35 | Table C.1 – Template for electronic COTS assembly manufacturer’s risk assessment |
| 41 | Table C.2 – Template for the plan owner’s mitigation and risk assessment of the electronic COTS assembly manufacturer analysed in Table C.1 |
| 48 | Annex D (informative)Typical electronic COTS assembly mitigation methods and techniques Table D.1 – Typical electronics COTS assembly mitigation methods and techniques |
| 56 | Annex E (informative) Requirements matrix for IEC TS 62239-2 Table E.1 – Requirements matrix for IEC TS 62239-2 |
| 63 | Bibliography |
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BSI PD IEC/TS 62239-2:2017
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