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BSI PD IEC TR 63378-1:2021:2022 Edition

BSI PD IEC TR 63378-1:2021:2022 Edition

$142.49

Thermal standardization on semiconductor packages – Thermal resistance and thermal parameter of BGA, QFP type semiconductor packages

Published By Publication Date Number of Pages
BSI 2022 24
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PDF Catalog

PDF Pages PDF Title
2 undefined
4 CONTENTS
5 FOREWORD
7 1 Scope
2 Normative references
3 Terms and definitions
3.1 Terms and letter symbols related to temperature (unit [°C or K])
8 3.2 Terms and letter symbols related to thermal characteristics
Figures
Figure 1 – Definition of temperature
9 Figure 2 – Definition of thermal resistance
10 Figure 3 – Thermal resistance
11 Figure 4 – Thermal resistance and thermal characterization parameter
12 4 Accuracy of θJA
4.1 Variation of θJA
4.1.1 General
4.1.2 Analysis model
Figure 5 – Thermal characterization parameter
13 4.1.3 Simulation conditions (typical values)
4.1.4 Evaluation items and standards
Figure 6 – Simulation conditions
Table 1 – Evaluation items and evaluation parameters
14 4.1.5 Evaluation results
Figure 7 – θJA dependence on board remaining copper rate (BGA)
15 Figure 8 – θJA dependence on remaining copper rate (LQFP)
16 Figure 9 – θJA dependence on ambient air temperature TA (BGA)
17 Figure 10 – θJA dependence on ambient air temperature TA (LQFP)
18 Figure 11 – θJA dependence on power dissipation (BGA)
19 4.1.6 Summary
Figure 12 – θJA dependence on power dissipation (LQFP)
Figure 13 – Influence items and their impact on θJA
20 4.2 Discrepancy of θJA
21 5 Guideline for thermal design
Figure 14 – The gap of θJA by the difference of the environment
22 Bibliography

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BSI PD IEC TR 63378-1:2021
$142.49