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BSI PD IEC/TR 62658:2013

BSI PD IEC/TR 62658:2013

$142.49

Roadmap of optical circuit boards and their related packaging technologies

Published By Publication Date Number of Pages
BSI 2013 24
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This Technical Report covers the roadmap of optical circuit boards, and its related packaging technologies including optical circuit board connectors and optical modules on boards.

PDF Catalog

PDF Pages PDF Title
4 CONTENTS
5 FOREWORD
7 1 Scope
2 General
2.1 Background of optical packaging technology road map
8 Figures
Figure 1 – Data transmission speed and capability trends for network traffic and server systems [2]
9 2.2 Advantages of optical interconnects
Figure 2 – Internet traffic and router power consumption in Japan [5]
10 Figure 3 – Increase of power consumption in future network
11 2.3 Planar embedded optical waveguides
3 Standardization of board-level optical packaging
3.1 Role of IEC TC86/JWG9 (with TC91)
Figure 4 – Comparison of power consumption of 10 Tbps electrical and optical routers
12 3.2 Optical circuit boards [20]
Figure 5 – Discussion field in IEC TC86/JWG9 (with TC91)
13 3.3 Optical backplanes [22]
Figure 6 – Classification of optical circuit boards
15 3.4 Optical circuit board connectors [23]
Figure 7 – Four types of optical backplane applications
16 3.5 Opto-electronic modules on boards
Figure 8 – Classification of optical circuit board connectors
17 3.6 Originating standards
Figure 9 – Classification of optical modules on boards
Figure 10 – De facto-standards in Japan [24]
18 4 Standardization road map
4.1 Performance trends for optical circuit boards
Figure 11 – Performance trends for optical circuit boards
19 5 Standardization road map of optical circuit boards
Figure 12 – Standardization roadmap of optical circuit boardand its related optical packaging
20 Bibliography

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BSI PD IEC/TR 62658:2013
$142.49