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BSI 20/30427157 DC:2020 Edition

BSI 20/30427157 DC:2020 Edition

$13.70

BS IEC 61189-2-808. Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-808. Thermal resistance of dielectric layer by thermal transient method

Published By Publication Date Number of Pages
BSI 2020 17
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Status

Definitive
Pages

17
Publication Date

2020-12-08
Standard Number

20/30427157 DC
Title

BS IEC 61189-2-808. Test methods for electrical materials, printed board and other interconnection structures and assemblies – Part 2-808. Thermal resistance of dielectric layer by thermal transient method
Identical National Standard Of

IEC 61189-2-808 Ed.1.0
Descriptors

Structures, Open systems interconnection, Printing board, Testing methods
Publisher

BSI
Committee

EPL/501
ICS Codes 31.180 - Printed circuits and boards

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BSI 20/30427157 DC
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