BS EN IEC 61189-5-502:2021
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Test methods for electrical materials, printed board and other interconnection structures and assemblies – General test methods for materials and assemblies. Surface insulation resistance (SIR) testing of assemblies
Published By | Publication Date | Number of Pages |
BSI | 2021 | 28 |
IEC 61189-5-502:2021 is used for evaluating the changes to the surface insulation resistance of a pre-selected material set on a representative test coupon and quantifies the deleterious effects of improperly used materials and processes that can lead to decreases in electrical resistance.
PDF Catalog
PDF Pages | PDF Title |
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2 | undefined |
5 | Annex ZA(normative)Normative references to international publicationswith their corresponding European publications |
7 | English CONTENTS |
9 | FOREWORD |
11 | 1 Scope 2 Normative references |
12 | 3 Terms and definitions 4 Equipment/Apparatus 4.1 Soldering and other production process equipment 4.2 Measurement instrument |
13 | 4.3 Resistor verification coupon 4.4 Damp heat chamber Figures Figure 1 – Resistor verification coupon using the IPC-B-52 coupon |
14 | 4.5 Magnifiers (10x – 30x) 4.6 Camera 4.7 Cleaning solvent 4.8 Interconnecting cable 4.9 Connector rack 4.10 Solder flux 5 Test coupon 5.1 Test coupon artwork 5.1.1 General |
15 | 5.1.2 Test coupon 5.1.3 Laminate 5.1.4 Surface finish 5.1.5 Solder mask 5.1.6 Quality 5.2 Components (bill of materials) |
16 | Figure 2 – IPC B-52 Rev B top side Figure 3 – IPC B-52 Rev B bottom side |
17 | 5.3 Number of test coupons 5.4 Test conditions Table 1 – IPC B-52 bill of materials (BOM) |
18 | 5.5 Coupon identification 6 Procedure 6.1 Test coupon preparation 6.2 Cleaning 6.3 Manufacturing process replication 6.4 Preparation of samples for chamber 6.5 Connector system – High-resistance measurement verification |
19 | 6.6 Hard wiring 6.7 Coupon orientation in the chamber 6.8 Test coupon measurements Figure 4 – Test specimen location with respect to chamber air flow |
20 | 6.9 Evaluation 6.10 Test report |
21 | 6.11 Additional information |
22 | Annex A (informative)Additional information A.1 Additional information A.1.1 General A.1.2 Advisory notes A.1.3 Use of coupon test pattern on production product A.2 Use of dummy components A.3 Frequency of monitoring |
23 | A.4 Condensation A.5 Flux volatilisation A.5.1 General A.5.2 90 % RH or 93 % RH A.6 Drip shield |
24 | A.7 Inspection A.8 Connector test racks A.8.1 Advantages A.8.2 Disadvantages A.9 Electromagnetic shielding |
25 | A.10 Wiring to the IPC B-52 test coupons Table A.1 – IPC B-52 Rev B wiring diagram |
26 | A.11 Connector test rack wiring A.12 Test voltage |
27 | Bibliography |