BS EN IEC 60738-1:2022:2023 Edition
$215.11
Thermistors. Directly heated positive temperature coefficient – Generic specification
Published By | Publication Date | Number of Pages |
BSI | 2023 | 72 |
This part of IEC 60738 describes terms and methods of test for positive step-function temperature coefficient thermistors, insulated and non-insulated types typically made from ferro-electric semi-conductor materials. It establishes standard terms, inspection procedures and methods of test for use in detail specifications for Qualification Approval and for Quality Assessment Systems for electronic components.
PDF Catalog
PDF Pages | PDF Title |
---|---|
2 | undefined |
5 | Annex ZA (normative)Normative references to international publicationswith their corresponding European publications |
7 | English CONTENTS |
12 | FOREWORD |
14 | 1 Scope 2 Normative references |
15 | 3 Terms and definitions |
17 | Figures Figure 1 – Typical resistance-temperature characteristicand definitions for PTC thermistors (at zero power) |
18 | Figure 2 – Typical R-TNF characteristic for PTC thermistors in sensor applications |
19 | Figure 3 – Typical current/voltage characteristic for PTC thermistors |
22 | Figure 4 – Iin against t at Udc Figure 5 – Iin against t at URMS |
24 | 4 General requirements 4.1 Units and symbols |
25 | 4.2 Preferred values 4.2.1 Climatic categories 4.2.2 Spacings 4.3 Marking 4.3.1 General Tables Table 1 – Creepage distances and clearances |
26 | 4.3.2 Coding 5 General provisions for measurements and test method 5.1 General 5.2 Standard conditions for testing 5.2.1 Standard atmospheric conditions for testing 5.2.2 Error of measurement 5.3 Drying and recovery 5.3.1 Drying |
27 | 5.3.2 Recovery 5.3.3 Shock test severities 5.3.4 Vibration severities 5.4 Mounting (for surface mount thermistors only) 5.4.1 General Table 2 – Test severities of vibration |
28 | 5.4.2 Printed wiring board and land pattern 5.4.3 Wave soldering method 5.4.4 Reflow soldering method |
29 | 6 Electrical tests and measurements 6.1 Zero-power resistance 6.1.1 General 6.1.2 Measurement procedures |
30 | 6.1.3 Requirements 6.2 Temperature coefficient of resistance 6.2.1 General 6.2.2 Requirements 6.3 Insulation resistance (for insulated types only) 6.3.1 General 6.3.2 Test methods |
31 | 6.3.3 Applied voltage 6.3.4 Requirements 6.4 Voltage proof (for insulated types only) 6.4.1 General 6.4.2 Test methods 6.4.3 Test voltage 6.4.4 Requirements 6.5 Resistance/temperature characteristic 6.5.1 Test methods |
32 | 6.5.2 Requirements 6.6 Dissipation factor at Umax (δ) 6.6.1 General 6.6.2 Preconditioning 6.6.3 Test circuit 6.6.4 Test methods |
33 | 6.6.5 Requirements 6.7 Response time by ambient temperature change (ta) 6.7.1 General 6.7.2 Preconditioning 6.7.3 Test procedures Figure 6 – Dissipation factor test circuit |
34 | 6.7.4 Measurement procedures 6.7.5 Requirements 6.8 Response time by power change (tp) 6.8.1 Mounting 6.8.2 Test methods Figure 7 – Temperature gradient |
35 | 6.9 Thermal time constant by ambient temperature change (τa) 6.10 Thermal time constant by cooling (τc) 6.10.1 Mounting 6.10.2 Test methods Figure 8 – Circuit for measurement of thermal time constant by cooling |
37 | 6.10.3 Requirements 6.11 Tripping current and tripping time 6.12 Non-tripping current 6.13 Residual current |
38 | 6.14 Surface temperature Figure 9 – Circuit for surface temperature measurement |
39 | 6.15 Inrush current 6.15.1 Measuring circuit 6.15.2 Measuring method Figure 10 – Measuring circuit |
40 | 6.16 Energy by discharge 6.16.1 Measuring circuit 6.16.2 Measuring method Figure 11 – Measuring circuit |
41 | 7 Mechanical test and measurements 7.1 Visual examination and check of dimensions 7.1.1 Visual examination 7.1.2 Marking 7.1.3 Dimensions (gauging) 7.1.4 Dimensions (detail) 7.2 Robustness of terminations 7.2.1 General 7.2.2 Test Ua1 – Tensile |
42 | 7.2.3 Test Ub – Bending 7.2.4 Test Uc – Torsion 7.2.5 Visual examination 7.2.6 Final measurements and requirements 7.3 Vibration Table 3 – Tensile force |
43 | 7.4 Shock 7.5 Shear (adhesion) test 7.5.1 Test conditions 7.5.2 Test methods 7.5.3 Requirements 7.6 Substrate bending test 7.6.1 Mounting |
44 | 7.6.2 Initial measurements 7.6.3 Test procedures 7.6.4 Measurements 7.6.5 Requirements 7.6.6 Final inspection and requirements 8 Environmental and climatic tests 8.1 Rapid change of temperature 8.2 Climatic sequence 8.2.1 General 8.2.2 Initial measurements |
45 | 8.2.3 Dry heat 8.2.4 Damp heat (cyclic), first cycle 8.2.5 Cold 8.2.6 Low air pressure 8.2.7 Damp heat (cyclic), remaining cycles 8.2.8 Final measurements Table 4 – Number of cycles per climatic category |
46 | 8.3 Damp heat, steady state 8.4 Endurance 8.4.1 Endurance at room temperature (cycling) |
47 | 8.4.2 Endurance at upper category temperature |
48 | 8.4.3 Endurance at maximum operating temperature and maximum voltage |
49 | 8.4.4 Cold environment electrical cycling Figure 12 – Circuit for endurance at maximum operating temperatureand maximum voltage |
50 | 8.4.5 Thermal runaway 9 Test related to component assembly 9.1 Solderability 9.1.1 General 9.1.2 Thermistors with leads |
51 | 9.1.3 Surface mount thermistors 9.2 Resistance to soldering heat 9.2.1 General 9.2.2 Test conditions |
52 | 9.2.3 The period of recovery 9.2.4 Requirements for except surface mount thermistors 9.2.5 Requirements for surface mount thermistors 10 Quality assessment procedures |
53 | Annex A (informative)Mounting for electrical measurements A.1 Mounting for thermistors without wire terminations A.2 Mounting for thermistors with wire terminations Figure A.1 – Example of a preferred mounting methodfor thermistors without wire terminations |
54 | A.3 Mounting for surface mount thermistors Figure A.2 – Example of a preferred mounting methodfor thermistors with wire terminations |
55 | Figure A.3 – Example of a preferred mounting method for surface mount thermistors Table A.1 – Recommended land dimensions |
56 | Annex B (informative)Mounting for temperature measurements Figure B.1 – Example of a preferred mounting method for temperature measurementon cylindrical heating elements |
57 | Annex Q (normative)Quality assessment procedures Q.1 General Q.2 Applicability of qualification approval Q.3 Primary stage of manufacture Q.4 Subcontracting Q.5 Structurally similar components Q.5.1 General |
58 | Q.5.2 For electrical tests Q.5.3 For environmental tests Q.5.4 For visual inspection Q.5.5 For endurance tests Q.6 Qualification approval procedures Q.6.1 Eligibility for qualification approval Q.6.2 Application for qualification approval Q.6.3 Test procedure for qualification approval |
59 | Q.6.4 Qualification approval based on the fixed sample size procedure |
61 | Table Q.1 – Fixed sample size test schedule for qualification approval of thermistorsfor current limitation – Assessment level EZ |
62 | Table Q.2 – Fixed sample size test schedule for qualification approval of thermistorsfor use as heating elements – Assessment level EZ |
63 | Table Q.3 – Fixed sample size test schedule for qualification approval of thermistorsfor inrush current application – Assessment level EZ |
64 | Q.6.5 Granting of qualification approval Q.6.6 Maintenance of qualification approval Table Q.4 – Fixed sample size test schedule for qualification approval of thermistorsfor use as temperature sensing elements – Assessment level EZ |
65 | Q.6.7 Quality conformance inspection Table Q.5 – Quality conformance inspection for lot-by-lot inspection |
66 | Q.7 Rework and repair Q.7.1 Rework Q.7.2 Repair Q.8 Release for delivery Q.8.1 General Table Q.6 – Quality conformance inspection for periodic testing |
67 | Q.8.2 Release for delivery under qualification approval before the completion of group B tests Q.9 Certified test records of released lots Q.10 Delayed delivery Q.11 Alternative test methods Q.12 Manufacture outside the geographical limits Q.13 Unchecked parameters |
68 | Annex X (informative)Cross-references to IEC 60738-1:2009 Table X.1 – Cross-references to the previous edition |
70 | Bibliography |