BS EN 61188-5-4:2007

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Printed boards and printed board assemblies. Design and use – Attachments (land/joint) considerations. Components with J leads on two sides

Published By	Publication Date	Number of Pages
BSI	2007	18

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Description

IEC 61188-5-4:2007 provides the component and land pattern dimensions for small outline integrated circuits with “J” leads on two sides (SOJ components) used in the reflow soldering process. Basic construction of the SOJ device is also covered. Clause 4 lists the tolerances and target solder joint dimensions used to arrive at the land pattern dimensions.

Additional information

Status	Definitive
Pages	18
Publication Date	2007-12-31
ISBN	978 0 580 59957 6
Standard Number	BS EN 61188-5-4:2007
Title	Printed boards and printed board assemblies. Design and use – Attachments (land/joint) considerations. Components with J leads on two sides
Identical National Standard Of	IEC 61479:2001, EN 61479:2001, EN 61188-5-4:2007, IEC 61188-5-4:2007
Descriptors	Printed circuits, Electronic equipment and components, Dimensional tolerances, Printed-circuit boards, Designations, Dimensions, Shape, Surface mounting devices, Soldered joints, Soldering, Design
Publisher	BSI
Committee	EPL/501
ICS Codes	31.180 - Printed circuits and boards

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BS EN 61188-5-4:2007

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