BS EN 60539-1:2016:2018 Edition

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Directly heated negative temperature coefficient thermistors – Generic specification

Published By	Publication Date	Number of Pages
BSI	2018	64

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Categories: 31.040.30 - Thermistors, BSI

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Description

This part of IEC 60539 is applicable to directly heated negative temperature coefficient thermistors, typically made from transition metal oxide materials with semiconducting properties.

It establishes standard terms, inspection procedures and methods of test for use in sectional and detail specifications of electronic components for quality assessment or any other purpose.

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PDF Pages	PDF Title
2	undefined
4	European foreword Endorsement notice
5	Annex ZA (normative) Normative references to international publications with their corresponding European publications
7	English CONTENTS
12	FOREWORD
14	1 Scope 2 Normative references
15	3 Terms and definitions
18	Figures Figure 1 – Typical resistance-temperature characteristic for NTC thermistors
20	Figure 2 – Decreased power dissipation curve
22	Figure 3 – Maximum current derating
25	4 General items 4.1 Units and symbols 4.2 Preferred values and appropriate category 4.2.1 General 4.2.2 Appropriate category 4.3 Marking 4.3.1 General Tables Table 1 – Lower and upper category temperatures and duration of the damp heat, steady state test
26	4.3.2 Marking for small size types such as surface mount thermistors 4.3.3 Coding 4.4 Quality assessment procedures 5 Test and measurement procedures 5.1 General 5.2 Standard atmospheric conditions for testing
27	5.3 Drying and recovery 5.3.1 Drying 5.3.2 Recovery 5.4 Mounting (for surface mount thermistors only) 5.4.1 General 5.4.2 Substrate and pad 5.4.3 Mounting on board
28	5.5 Visual examination and check of dimensions 5.5.1 Visual examination
29	5.5.2 Dimensions 5.6 Zero-power resistance 5.6.1 General 5.6.2 Measurement procedures 5.6.3 Requirements Figure 4 – Basic circuit for zero-power resistance measurement
30	5.7 B-value or resistance ratio 5.7.1 General 5.7.2 Requirements 5.8 Insulation resistance (for insulated types only) 5.8.1 General 5.8.2 Test methods Figure 5 – Example of Method 1 for testing the insulation resistance
31	Figure 6 – Example of Method 2 for testing the insulation resistance (1) Figure 7 – Example of Method 2 for testing the insulation resistance (2)
32	5.8.3 Applied voltage Figure 8 – Example of Method 3 for testing the insulation resistance Figure 9 – Example of Method 4 for testing the insulation resistance
33	5.8.4 Requirements 5.9 Voltage proof (for insulated types only) 5.9.1 General 5.9.2 Test voltage 5.9.3 Requirements 5.10 Resistance/temperature characteristic 5.10.1 General 5.10.2 Test methods 5.10.3 Requirements 5.11 Dissipation factor (δ) 5.11.1 General
34	5.11.2 Initial measurements 5.11.3 Test methods Figure 10 – Example of test chamber
35	5.11.4 Requirements 5.12 Thermal time constant by ambient temperature change (τa) 5.12.1 The hot to cold thermal time constant for ambient temperature change Figure 11 – Dissipation factor measuring circuit
36	5.12.2 The cold to hot thermal time constant for ambient temperature change 5.12.3 Final measurements and requirements 5.12.4 Requirements 5.13 Thermal time constant by cooling after self-heating (τc) 5.13.1 General 5.13.2 Initial measurements
37	5.13.3 Preconditioning 5.13.4 Test method 5.13.5 Final measurements and requirements Figure 12 – Thermal time constant measuring circuit
38	5.14 Robustness of terminations (not applicable to surface mount thermistors) 5.14.1 General 5.14.2 Initial measurements 5.14.3 Test methods 5.14.4 Test Ua1 – Tensile 5.14.5 Test Ub – Bending (half the number of terminations) 5.14.6 Test Uc – Torsion (remaining terminations) Table 2 – Tensile force
39	5.14.7 Final measurements and requirements 5.15 Resistance to soldering heat 5.15.1 General 5.15.2 Preconditioning 5.15.3 Test procedure 5.15.4 Recovery 5.15.5 Final inspection, measurement and requirements
40	5.16 Solderability 5.16.1 General 5.16.2 Test procedure 5.16.3 Final inspection, measurements and requirements 5.17 Rapid change of temperature 5.17.1 General 5.17.2 Initial measurements 5.17.3 Test procedures
41	5.17.4 Final inspection, measurements and requirements 5.18 Vibration 5.18.1 General 5.18.2 Initial measurements 5.18.3 Test procedures 5.18.4 Final inspection, measurements and requirements
42	5.19 Shock 5.19.1 General 5.19.2 Initial measurements 5.19.3 Mounting 5.19.4 Test procedures 5.19.5 Final inspection, measurements and requirements 5.20 Free fall 5.20.1 General 5.20.2 Initial measurements 5.20.3 Test procedures 5.20.4 Final inspection, measurements and requirements 5.21 Thermal shock 5.21.1 General
43	5.21.2 Initial measurements 5.21.3 Test procedures 5.21.4 Final inspection, measurements and requirements 5.22 Cold 5.22.1 General 5.22.2 Initial measurements 5.22.3 Test procedures
44	5.22.4 Final inspection, measurements and requirements 5.23 Dry heat 5.23.1 General 5.23.2 Initial measurements 5.23.3 Test procedures 5.23.4 Final inspection, measurements and requirements 5.24 Damp heat, steady state 5.24.1 General
45	5.24.2 Initial measurements 5.24.3 Test procedures 5.24.4 Recovery 5.24.5 Final inspection, measurements and requirements 5.25 Endurance 5.25.1 General 5.25.2 Endurance at room temperature with applied continuous maximum current (Imax25) (for inrush current-limiting thermistors only)
46	5.25.3 Endurance at room temperature with applied cyclic maximum current (Imax25) (for inrush current-limiting thermistors only) Figure 13 – Endurance at room temperature with Imax25 evaluating circuit
47	5.25.4 Endurance at T3 and Pmax
48	5.25.5 Endurance at upper category temperature
49	5.25.6 Maximum permissible capacitance (for inrush current-limiting thermistors only) Figure 14 – Maximum permissible capacitance test circuit (Method 1)
50	5.26 Shear (adhesion) test (for surface mount thermistors only) 5.26.1 General Figure 15 – Maximum permissible capacitance test circuit (Method 2)
51	5.26.2 Test conditions 5.26.3 Requirements 5.27 Substrate bending test (for surface mount thermistors only) 5.27.1 General 5.27.2 Initial measurements 5.27.3 Test procedures 5.27.4 Final inspection and requirements 5.28 Component solvent resistance 5.28.1 General
52	5.28.2 Initial measurements 5.28.3 Test conditions 5.28.4 Requirements 5.29 Solvent resistance of marking 5.29.1 General 5.29.2 Test conditions 5.29.3 Requirements 5.30 Salt mist 5.30.1 General 5.30.2 Test conditions 5.31 Sealing
53	5.32 Composite temperature/humidity cycle 5.32.1 General 5.32.2 Initial measurements 5.32.3 Test conditions 5.32.4 Final inspection, measurements and requirements
54	Annex A (normative) Interpretation of sampling plans and procedures as described in IEC 60410:1973 for use within quality assessment systems A.1 Clause and subclause numbers of IEC 60410:1973
55	Annex B (normative) Rules for the preparation of detail specifications for directly heated thermistors for electronic equipment for use within quality assessment systems B.1 Drafting B.2 Reference standard B.3 Circulation
56	Annex C (informative) Typical examples of mountings for measurements ofdirectly heated thermistors C.1 Mounting for surface mount thermistors
57	Figure C.1 – Mounting for measurements of surface mount thermistors
58	Annex D (informative) Reference to IEC 60539-1:2008
59	Annex Q (normative) Quality assessment procedures Q.1 General Q.2 Primary stage of manufacture Q.3 Structurally similar components
60	Q.4 Qualification approval procedures Q.4.1 General Q.4.2 Test procedure for qualification approval Q.4.3 Maintenance of qualification approval
61	Q.5 Quality conformance inspection Q.6 Certified test records of released lots Q.7 Delayed delivery Q.8 Release for delivery under qualification approval before the completion of group B tests Q.9 Alternative test methods Q.10 Unchecked parameters
62	Bibliography

Additional information

Status	Withdrawn
Title	Directly heated negative temperature coefficient thermistors – Generic specification
Corrects	BS EN 60539-1:2016
Publisher	BSI
Committee	W/-
Pages	64
Publication Date	2018-01-31
Withdrawn Date	2023-02-06
Replaced By	BS EN IEC 60539-1:2023
ISBN	978 0 580 51914 7
Standard Number	BS EN 60539-1:2016
Identical National Standard Of	IEC 60539-1:2016/COR1:2017, EN 60539-1:2016/AC:2017-09, EN 60539-1:2016/AC:2017-09
Descriptors	Specification (approval), Metal oxide semiconductors, Acceptance (approval), Detail specification, Semiconductor resistors, Assessed quality, Thermistors, Electrical testing, Resistors, Electronic equipment and components, Temperature coefficient of resistance, Semiconductor devices, Inspection, Quality control
ICS Codes	31.040.30 - Thermistors

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