BS EN 16603-20-08:2023 – TC
$280.87
Tracked Changes. Space engineering. Photovoltaic assemblies and components
| Published By | Publication Date | Number of Pages |
| BSI | 2023 | 479 |
PDF Catalog
| PDF Pages | PDF Title |
|---|---|
| 1 | 30480456 |
| 246 | A-30455891 |
| 247 | undefined |
| 261 | 1 Scope |
| 262 | 2 Normative references |
| 264 | 3 Terms, definitions and abbreviated terms 3.1 Terms from other standards 3.2 Terms specific to the present standard |
| 269 | 3.3 Abbreviated terms |
| 272 | 3.4 Nomenclature |
| 273 | 4 General 4.1 Overview 4.1.1 Objective and organization |
| 275 | 4.1.2 Interfaces with other areas |
| 276 | 4.2 Physical properties 4.3 Test and storage 4.3.1 Test environment |
| 277 | 4.3.2 Test tolerances and accuracies |
| 278 | 4.3.3 <> 4.4 Critical materials |
| 279 | 5 Photovoltaic assemblies 5.1 Overview 5.1.1 Description 5.1.2 Purpose and objective |
| 280 | 5.2 Conditions and method of test |
| 281 | 5.3 Photovoltaic assembly design 5.3.1 Overview 5.3.2 Parameters related to parts, materials and processes (PMP) 5.3.2.1 Outgassing 5.3.2.2 Toxicity |
| 282 | 5.3.2.3 Flammability 5.3.2.4 Corrosion 5.3.2.5 Magnetism 5.3.2.6 Erosion 5.3.2.7 Atomic oxygen (ATOX) 5.3.3 Parameters related to design 5.3.3.1 Cell integration |
| 283 | 5.3.3.2 Stringing 5.3.3.3 Cell interspacing 5.3.3.4 Sectioning 5.3.3.5 Reverse bias protection |
| 284 | 5.3.3.6 Insulation 5.3.3.7 Derating 5.3.3.8 Redundancy 5.3.3.9 Fault tolerance |
| 285 | 5.3.3.10 Fatigue resistance 5.3.3.11 Adherence to substrate 5.3.3.12 Adhesive uniformity 5.3.3.13 Electrostatic discharge (ESD) 5.3.3.14 Electromagnetic compatibility (EMC) |
| 286 | 5.3.3.15 Repairability 5.4 PVA manufacturing 5.4.1 Process validation 5.4.2 Defect acceptability 5.4.3 In-process testing 5.4.3.1 Overview 5.4.3.2 Mass measurement 5.4.3.3 Wet insulation test |
| 287 | 5.4.3.4 Adherence to substrate 5.4.3.5 Visual inspection 5.4.3.6 Continuity check |
| 288 | 5.4.4 Identification and traceability 5.4.5 Recording 5.5 PVA tests 5.5.1 Qualification tests 5.5.1.1 Purpose 5.5.1.2 Process |
| 290 | 5.5.1.3 Fatigue thermal cycling test |
| 292 | 5.5.1.4 Humidity |
| 293 | 5.5.1.5 Electrostatic discharge (ESD) test |
| 296 | 5.5.1.6 Erosion of materials 5.5.1.7 EMC |
| 297 | 5.5.2 Acceptance tests for qualification coupons 5.5.2.1 Purpose 5.5.2.2 Applicability 5.5.2.3 Deliverables 5.5.2.4 Process |
| 298 | 5.5.3 Definition of tests and checks 5.5.3.1 Add-on mass measurement 5.5.3.2 Full visual inspection |
| 303 | 5.5.3.3 Electrical health check |
| 305 | 5.5.3.4 Electrical performance measurement |
| 306 | 5.5.3.5 Capacitance test 5.5.3.6 Bake-out 5.5.3.7 Thermal cycling acceptance test |
| 307 | 5.5.3.8 Reflectance |
| 308 | 5.5.3.9 X-Ray 5.5.3.10 Substrate integrity 5.5.3.11 Vacuum thermal cycling |
| 309 | 5.6 Failure definition 5.6.1 Failure criteria |
| 310 | 5.6.2 Failed qualification coupons 5.7 Data documentation 5.8 Delivery 5.9 Packaging, packing, handling and storage |
| 311 | 6 Solar cell assemblies 6.1 General 6.1.1 Testing 6.1.2 Conditions and methods of test 6.1.3 Deliverable components 6.1.4 Identification and traceability |
| 312 | 6.2 Production control (process identification document) 6.3 Acceptance tests 6.3.1 General 6.3.2 Test methods and conditions |
| 313 | 6.3.3 Electrical performance acceptance test (EPA) 6.3.3.1 Purpose 6.3.3.2 Process 6.3.3.3 Pass-fail criteria 6.4 Qualification tests 6.4.1 General |
| 315 | 6.4.2 Qualification 6.4.2.1 Production and test schedule 6.4.2.2 Qualification test samples |
| 316 | 6.4.2.3 Qualification testing 6.4.3 Test methods, conditions and measurements 6.4.3.1 Full visual inspection including ELM (VI) |
| 319 | 6.4.3.2 Dimensions and weight (DW) 6.4.3.3 Electrical performance (EP) |
| 320 | 6.4.3.4 Temperature coefficients (TC) |
| 321 | 6.4.3.5 Spectral response (SR) 6.4.3.6 Thermo-optical data (TO) |
| 322 | 6.4.3.7 Thermal cycling (CY) 6.4.3.8 Humidity and temperature (HT1) |
| 324 | 6.4.3.9 Coating adherence (CA) 6.4.3.10 Interconnector adherence (IA) 6.4.3.11 Electron irradiation (EI) |
| 325 | 6.4.3.12 Photon irradiation and temperature annealing (PH) |
| 326 | 6.4.3.13 Surface conductivity (SC) 6.4.3.14 Solar Cell Reverse Bias Test (RB) 6.4.3.15 Ultraviolet exposure test (UV) |
| 328 | 6.4.3.16 Capacitance test (CT) |
| 329 | 6.4.3.17 Flatness test (FT) 6.4.3.18 Long Duration – Life test (LT) |
| 330 | 6.4.3.19 Angular Measurement (AM) |
| 332 | 6.5 Failure definition 6.5.1 Failure criteria 6.5.2 Failed SCAs 6.6 Data documentation 6.7 Delivery |
| 333 | 6.8 Packing, dispatching, handling and storage 6.8.1 Overview 6.8.2 ESD Sensitivity |
| 334 | 7 Bare solar cells 7.1 Testing, deliverable components and marking 7.1.1 Testing 7.1.1.1 Tests for qualification and procurement 7.1.1.2 Conditions and methods of tests 7.1.1.3 Responsibility of supplier for the performance of tests and inspections |
| 335 | 7.1.1.4 Preliminary characterization 7.1.2 Deliverable components 7.1.3 Marking 7.2 Production control (process identification document) |
| 336 | 7.3 Acceptance tests 7.3.1 General 7.3.2 Test methods and conditions 7.3.2.1 Test other than electrical performance |
| 337 | 7.3.2.2 Electrical performance 7.3.3 Documentation 7.4 Qualification tests 7.4.1 General |
| 339 | 7.4.2 Qualification 7.4.2.1 Production and test schedule 7.4.2.2 Qualification test samples |
| 340 | 7.4.2.3 Qualification testing 7.5 Test methods, conditions and measurements 7.5.1 Visual inspection including ELM (VI) 7.5.1.1 Applicability 7.5.1.2 Test process 7.5.1.3 Deviations |
| 341 | 7.5.1.4 Solar cell defects |
| 342 | 7.5.1.5 Solar cell contact area defects 7.5.2 Dimensions and weight (DW) |
| 343 | 7.5.3 Electrical performance (EP) 7.5.3.1 Purpose 7.5.3.2 Process 7.5.4 Temperature coefficients (TC) |
| 344 | 7.5.5 Spectral response (SR) 7.5.5.1 Purpose 7.5.5.2 Process |
| 345 | 7.5.6 Optical properties (OP) 7.5.6.1 Overview 7.5.6.2 Hemispherical reflectance (HR) 7.5.6.3 Coverglass gain-loss (GL) 7.5.6.4 Solar absorptance (as) 7.5.7 Humidity and temperature (HT) 7.5.7.1 HT1 for qualification testing (subgroup O) |
| 346 | 7.5.7.2 HT2 for qualification (subgroup A) and acceptance testing |
| 347 | 7.5.8 Coating adherence (CA) 7.5.8.1 Purpose 7.5.8.2 Process 7.5.9 Contact uniformity (CU) 7.5.9.1 Purpose 7.5.9.2 Process 7.5.9.3 Pass fail criteria |
| 348 | 7.5.10 Contact thickness (CT) 7.5.10.1 Purpose 7.5.10.2 Process 7.5.10.3 Pass fail criteria 7.5.11 Surface finish (SF) 7.5.11.1 Purpose 7.5.11.2 Process 7.5.11.3 Pass fail criteria 7.5.12 Pull test (PT) 7.5.12.1 Purpose 7.5.12.2 Process |
| 349 | 7.5.13 Electron irradiation (EI) 7.5.13.1 Purpose 7.5.13.2 Process |
| 350 | 7.5.14 Proton irradiation (PI) 7.5.14.1 Purpose 7.5.14.2 Process |
| 352 | 7.5.15 Photon irradiation and temperature annealing (PH) 7.5.15.1 Purpose 7.5.15.2 Process 7.5.16 Solar cell reverse bias test (RB) 7.5.16.1 Purpose 7.5.16.2 Process |
| 353 | 7.5.16.3 Pass-fail criteria 7.5.17 Thermal cycling (CY) 7.5.17.1 Purpose 7.5.17.2 Process 7.5.18 Active-passive interface evaluation test (IF) 7.5.18.1 Purpose 7.5.18.2 Process 7.5.19 Flatness test (FT) 7.5.19.1 Purpose |
| 354 | 7.5.19.2 Process 7.5.19.3 Pass/fail criteria. 7.6 Failure definition 7.6.1 Failure criteria 7.6.2 Failed components 7.7 Data documentation |
| 355 | 7.8 Delivery 7.9 Packing, dispatching, handling and storage 7.9.1 Overview 7.9.2 ESD Sensitivity |
| 356 | 8 Coverglasses 8.1 Overview 8.1.1 Purpose 8.1.2 Description 8.2 Interfaces 8.3 Testing, deliverable components and marking 8.3.1 Testing 8.3.1.1 Tests for qualification and procurement |
| 357 | 8.3.1.2 Conditions and methods of tests 8.3.1.3 Responsibility of supplier for the performance of tests and inspections 8.3.2 Deliverable components 8.3.3 Marking (coating orientation) |
| 358 | 8.4 Production control (Process identification document) 8.5 Acceptance test 8.5.1 Acceptance test samples 8.5.2 Acceptance test sequence |
| 359 | 8.5.3 Test methods and conditions 8.5.4 Documentation 8.6 Qualification tests 8.6.1 General |
| 360 | 8.6.2 Qualification 8.6.2.1 Production and test schedule 8.6.2.2 Qualification test samples 8.6.2.3 Qualification testing |
| 362 | 8.7 Test methods, conditions and measurements 8.7.1 Visual inspection (VI) 8.7.1.1 General 8.7.1.2 Deviations 8.7.1.3 Defects |
| 363 | 8.7.2 Transmission into air (TA) |
| 364 | 8.7.3 Electro-optical properties (EO) 8.7.3.1 Bulk and surface resistivity 8.7.3.2 Refractive index 8.7.4 Mechanical properties (MP) 8.7.4.1 Dimension and weight |
| 365 | 8.7.4.2 Density 8.7.4.3 Thickness 8.7.4.4 Edge parallelism 8.7.4.5 Perpendicularity of sides 8.7.5 Reflectance properties (OP) 8.7.5.1 Reflectance 8.7.5.2 Reflectance cut-on |
| 366 | 8.7.5.3 Reflectance cut-off 8.7.5.4 Reflectance bandwidth 8.7.6 Normal emittance (NE) 8.7.7 Surface resistivity (SC) |
| 367 | 8.7.8 Flatness or bow (FT) 8.7.9 Transmission into adhesive (TH) |
| 368 | 8.7.10 Boiling water test (BW) 8.7.11 Humidity and temperature 8.7.11.1 HT3 for qualification testing (subgroup O) 8.7.11.2 HT4 for acceptance testing |
| 369 | 8.7.12 UV exposure (UV) 8.7.12.1 Purpose 8.7.12.2 Process 8.7.13 Electron irradiation (EI) 8.7.13.1 Purpose 8.7.13.2 Process |
| 370 | 8.7.14 Proton irradiation (PI) 8.7.14.1 Purpose 8.7.14.2 Process 8.7.15 Breaking strength (BS) 8.7.16 Thermal cycling (CY) |
| 371 | 8.7.17 Abrasion resistance (coated surface) (AE) 8.7.18 Coating adhesion (TD) 8.8 Failure definition 8.8.1 Failure criteria 8.8.2 Failed components |
| 372 | 8.9 Data documentation 8.10 Delivery 8.11 Packing, dispatching, handling and storage |
| 373 | 9 Solar cell protection diodes 9.1 Overview 9.2 Testing, deliverable components and marking 9.2.1 Testing 9.2.1.1 Tests for qualification and procurement |
| 374 | 9.2.1.2 Conditions and methods of tests 9.2.1.3 Responsibility of supplier for the performance of tests and inspections 9.2.2 Deliverable components 9.2.2.1 Integral protection diodes |
| 375 | 9.2.2.2 External protection diodes 9.2.3 Marking 9.3 Production control (process identification document) 9.3.1 Integral protection diodes 9.3.2 External protection diodes 9.4 Acceptance tests 9.4.1 General |
| 376 | 9.4.2 Integral protection diodes 9.4.3 External protection diodes 9.4.4 External and integral diodes |
| 377 | 9.4.5 Test methods and conditions 9.4.5.1 Production and test schedule 9.4.5.2 Diode characterization for acceptance (DCA) 9.4.6 Documentation |
| 378 | 9.5 Qualification tests 9.5.1 General 9.5.2 Integral protection diodes |
| 379 | 9.5.3 External protection diodes |
| 381 | 9.5.4 Integral and external protection diodes 9.5.4.1 Production and test schedule 9.5.4.2 Qualification test samples |
| 382 | 9.5.4.3 Qualification testing 9.6 Test methods, conditions and measurements 9.6.1 General 9.6.2 Visual inspection (VI) 9.6.2.1 Applicability 9.6.2.2 Test process |
| 383 | 9.6.2.3 Deviations 9.6.2.4 Protection diode defects 9.6.2.5 External protection diode contact area defects 9.6.3 Dimensions and weight (DW) |
| 384 | 9.6.4 Thermal cycling (CY) 9.6.4.1 Purpose 9.6.4.2 Process 9.6.5 Burn in (BI) 9.6.5.1 Purpose 9.6.5.2 Process |
| 385 | 9.6.6 Humidity and temperature 9.6.6.1 HT1 for qualification testing (subgroup O) 9.6.6.2 HT2 for acceptance testing |
| 386 | 9.6.7 Contact uniformity (CU) 9.6.7.1 Purpose 9.6.7.2 Process 9.6.7.3 Pass Fail Criteria 9.6.8 Contact thickness (CT) 9.6.8.1 Purpose 9.6.8.2 Process 9.6.8.3 Pass Fail Criteria 9.6.9 Surface Finish (SF) 9.6.9.1 Purpose |
| 387 | 9.6.9.2 Process 9.6.9.3 Pass Fail Criteria 9.6.10 Contact adherence (CA) 9.6.10.1 Purpose 9.6.10.2 Process |
| 388 | 9.6.11 Pull test (PT) 9.6.11.1 Purpose 9.6.11.2 Process |
| 389 | 9.6.12 Electron irradiation (EI) 9.6.12.1 Purpose 9.6.12.2 Process 9.6.13 Temperature annealing (TA) 9.6.13.1 Purpose |
| 390 | 9.6.13.2 Process 9.6.14 Temperature behaviour (TB) 9.6.14.1 Purpose 9.6.14.2 Process 9.6.15 Diode characterization (DC) 9.6.15.1 Purpose 9.6.15.2 Process |
| 391 | 9.6.15.3 Pass-fail criteria 9.6.16 Human body ESD (DE) 9.6.16.1 Purpose |
| 392 | 9.6.16.2 Process 9.6.16.3 Pass-fail criteria 9.6.17 Switching test (DS) 9.6.17.1 Purpose 9.6.17.2 Process |
| 394 | 9.6.17.3 Pass-fail criteria 9.6.18 Long Duration – Life test (LT) 9.6.18.1 Purpose |
| 395 | 9.6.18.2 Process |
| 396 | 9.6.18.3 Pass-fail criteria 9.7 Failure definition 9.7.1 Failure criteria |
| 397 | 9.7.2 Failed components 9.8 Data documentation 9.9 Delivery 9.10 Packing, despatching, handling and storage 9.10.1 Overview 9.10.2 ESD sensitivity |
| 398 | 10 Solar simulators and calibration procedures 10.1 Solar simulators 10.1.1 Spectral distribution 10.1.1.1 AM0 spectrum 10.1.1.2 Total Irradiance of the Solar simulator 10.1.1.3 Spectral distribution of the Solar simulator |
| 400 | 10.1.2 Irradiance uniformity |
| 401 | 10.1.3 Irradiance stability |
| 402 | 10.2 Standard cell and Solar simulator calibration 10.2.1 Primary standards 10.2.2 Secondary working standards (SWS) 10.2.2.1 Selection of secondary working standards 10.2.2.2 <> |
| 403 | 10.2.2.3 Secondary working standards performance requirements |
| 404 | 10.2.3 Standards cells documentation 10.2.4 Maintenance of standards 10.2.5 Recalibration and intercomparison 10.2.6 Solar simulator calibration and maintenance 10.2.6.1 Solar simulator calibration |
| 405 | 10.2.6.2 Solar simulator maintenance |
| 406 | 11 Capacitance measurement methods 11.1 Single junction solar cell capacitance measurement 11.1.1 Overview 11.1.1.1 General 11.1.1.2 Description 11.1.2 Signal measurement method |
| 407 | 11.1.3 Measurement procedure 11.1.3.1 Preparation of the measurement equipment |
| 408 | 11.1.3.2 Process for calibration of the test equipment |
| 410 | 11.1.3.3 Measurement of the cell with the network analyser 11.1.4 Measurement analysis 11.1.4.1 Correction of the measurement with respect to the actual impedance of the shunt (impedance values from the B/A measurements) |
| 411 | 11.1.4.2 Modelling |
| 413 | 11.1.5 Measurement of the capacitance of a multi-junction cell |
| 414 | 11.2 Time domain capacitance measurement 11.2.1 Overview 11.2.1.1 General 11.2.1.2 Description |
| 415 | 11.2.2 Measurement procedure 11.2.2.1 Measurement equipment set-up 11.2.2.2 Calibration of the measurement equipment 11.2.2.3 Performance measurement 11.2.2.4 Data processing |
| 417 | 12 Planar Blocking Diodes 12.1 Overview 12.2 Testing, deliverable components and Marking 12.2.1 Testing 12.2.1.1 Tests for qualification and procurement 12.2.1.2 Conditions and methods of tests |
| 418 | 12.2.1.3 Responsibility of supplier for the performance of tests and inspections 12.2.2 Deliverable components 12.2.3 Marking |
| 419 | 12.3 Production control (process identification document) 12.4 Acceptance test 12.4.1 General 12.4.2 Planar blocking diodes |
| 420 | 12.5 Qualification tests 12.5.1 General 12.5.2 Blocking diodes 12.5.3 Production and test schedule 12.5.4 Qualification test samples |
| 421 | 12.5.5 Qualification testing |
| 424 | 12.6 Test methods, conditions and measurements 12.6.1 Visual inspection (VI) 12.6.1.1 Process 12.6.1.2 Deviations 12.6.1.3 Defects 12.6.2 Dimensions and weight (DW) |
| 425 | 12.6.3 Diode characterization (DC) 12.6.3.1 Purpose 12.6.3.2 Process 12.6.3.3 Pass/fail criteria 12.6.4 Humidity and Temperature 12.6.4.1 HT1 for qualification testing (subgroup O) |
| 426 | 12.6.4.2 HT2 for acceptance testing |
| 427 | 12.6.5 Temperature Cycling (CY) 12.6.5.1 Purpose 12.6.5.2 Process 12.6.6 Contact Adherence (CA) 12.6.6.1 Purpose 12.6.6.2 Process 12.6.6.3 Pass/fail criteria |
| 428 | 12.6.7 Burn-in (BI) 12.6.7.1 Purpose 12.6.7.2 Power Burn-in (FWD-BI) 12.6.7.3 High Temperature Reverse Bias Burn-in (HTRB-BI) |
| 429 | 12.6.8 Long duration-Life Test (LT) 12.6.8.1 Purpose 12.6.8.2 Process 12.6.8.3 Pass/fail criteria 12.6.9 Temperature behaviour test (TB) 12.6.9.1 Purpose 12.6.9.2 Process |
| 430 | 12.6.10 Temperature robustness test (TR) 12.6.10.1 Purpose 12.6.10.2 Process 12.6.11 Total Dose Radiation Testing (RT) 12.6.11.1 Ionising radiation test |
| 431 | 12.6.11.2 Non-ionising radiation test |
| 432 | 12.6.12 Temperature Annealing (TA) 12.6.12.1 Purpose 12.6.12.2 Process 12.6.13 Contact uniformity test (CU) 12.6.13.1 Purpose |
| 433 | 12.6.13.2 Process 12.6.13.3 Pass-fail criteria 12.6.14 Surface Finish test (SF) 12.6.14.1 Purpose 12.6.14.2 Process 12.6.14.3 Pass-fail criteria 12.6.15 Human Body ESD test (ESD) 12.6.15.1 Purpose 12.6.15.2 Process 12.6.15.3 Pass-fail criteria |
| 434 | 12.6.16 Pull test (PT) / Interconnector adherence test (IA) 12.6.16.1 Purpose 12.6.16.2 Process 12.6.16.3 Pass-fail criteria 12.6.17 Surge test (ST) 12.6.17.1 Purpose 12.6.17.2 Process 12.6.17.3 Pass-Fail criteria |
| 435 | 12.6.18 Thermo-optical data (TO) 12.6.18.1 Purpose 12.6.18.2 Process 12.6.18.3 Pass-fail criteria 12.7 Failure definition 12.7.1 Failure criteria 12.7.2 Failed Blocking Diodes |
| 436 | 12.8 Data documentation 12.9 Delivery 12.10 Packing, despatching, handling and storage 12.10.1 Overview 12.10.2 ESD sensitivity |
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