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BS 3934-5:1997

BS 3934-5:1997

$167.15

Mechanical standardization of semiconductor devices – Recommendations applying to tape automated bonding (TAB) of integrated circuits

Published By Publication Date Number of Pages
BSI 1997 38
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This part of IEC 60191 on mechanical standardization gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. This standard is applicable to the finished component supplied by a manufacturer to a user and does not define requirements relating to the IC to tape interface (the inner lead bond or ILB).

Applicable to the finished component supplied to a user and does not define requirements relating to the IC to tape interface (the inner lead bond or ILB).

BS 3934-5:1997
$167.15