ASTM-F636 1991
$35.75
F636-85(1991) Guide for Selection of Tests for Material Properties of Transfer Molding Compounds for Electronic and Microelectronic Encapsulation (Withdrawn 1996)
Published By | Publication Date | Number of Pages |
ASTM | 1991 |
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ASTM F636-85-Reapproved1991
Withdrawn Standard: Guide for Selection of Tests for Material Properties of Transfer Molding Compounds for Electronic and Microelectronic Encapsulation (Withdrawn 1996)
ASTM F636
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DOI:
Standard Title | F636-85(1991) Guide for Selection of Tests for Material Properties of Transfer Molding Compounds for Electronic and Microelectronic Encapsulation (Withdrawn 1996) |
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Published Code | ASTM |
Publication Date | 1991 |
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