ASTM-B885 1997

$35.75

B885-97 Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts

Published By	Publication Date	Number of Pages
ASTM	1997	11

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Category: ASTM

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Description

ASTM B885-97

Historical Standard: Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts

ASTM B885

Scope

1.1 This test method defines a resistance probing test for detecting the presence of foreign matter on Printed Wiring Board (PWB) contacts or fingers that adversely affects electrical performance. This test method is defined specifically for such fingers coated with gold. Application of this test method to other types of electrical contacts or to fingers coated with other materials may be possible and desirable but may require some changes in fixturing, procedures, or failure criteria.

1.2 Practice B 667 describes another contact resistance probe method that has more general application to electrical contacts of various materials and shapes. Practice B 667 should be used for more fundamental studies. This test method provides a fast inspection method for printed wiring board fingers.

1.3 This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.

Keywords

contact resistance; contamination; edgecard connector; printed wiring board fingers

ICS Code

ICS Number Code n/a

DOI: 10.1520/B0885-97

Additional information

Standard Title	B885-97 Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts
Published Code	ASTM
Publication Date	1997
Pages Count	11